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Package Intersil K4.A

ManufacturerIntersil
SeriesCFP
Part NumberK4.A

4 Lead Ceramic Metal Seal Flatpack Package (100 mil Lead Pitch)

Package Outline Drawing (POD)

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    Hermetic Packages for Integrated Circuits Package Outline Drawing
    K4.A
    4 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE (100 mil LEAD PITCH)
    Rev 0, 3/17 0.100 (2.54 BSC) NO. 1
    NO. 2 0.022 (0.56)
    0.015 (0.38) PIN # 1
    ID AREA
    1 NO. 4
    NO. 3 TOP VIEW 0.112 (2.84)
    0.090 (2.29) 0.038 (0.97)
    5
    0.026 (0.66) 0.265 (6.75)
    0.245 (6.22) A
    A 0.173 (4.39)
    0.157 (3.99) 0.005 (0.13)
    MIN 3 -D0.009 (0.23)
    0.004 (0.10)
    -H-C-0.183 (4.65)
    SEATING AND
    BASE PLANE 0.167 (4.24) 0.370 (9.40)
    0.325 (8.26)
    0.03 (0.76) MIN SIDE VIEW BOTTOM VIEW NOTES:
    1. Index area: A notch or a pin 1 identification mark shall be located ...

Parametrics

FamilyCFP
Height max0.11 inch
Length0.17 inch
Package IndexK4.A
Pin Count4
Pitch0.10 inch
Weight0.24 g
Width0.26 inch

Moldel Line

Series: CFP (17)

Manufacturer's Classification

  • Hermetic Packages

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