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Package Intersil J28.A

Package Intersil J28.A

ManufacturerIntersil
SeriesCLCC
Part NumberJ28.A

Mil-Std-1835 CQCC1-N28 (C-4) 28 Pad Ceramic Leadless Chip Carrier Package

Package Outline Drawing (POD)

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    Hermetic Packages for Integrated Circuits
    Ceramic Leadless Chip Carrier Packages (CLCC)
    J28.A MIL-STD-1835 CQCC1-N28 (C-4)
    28 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S
    D INCHES D3 j x 45o E3 B E h x 45o
    0.010 S E F S
    A A1
    PLANE 2
    PLANE 1 -E-MIN MAX MIN MAX NOTES A 0.060 0.100 1.52 2.54 6, 7 A1 0.050 0.088 1.27 2.23 -B --B1 0.022 0.028 0.56 0.71 2, 4 B2 B1 e
    L -H-L3 0.072 REF -0.006 0.022 0.15 0.56 -D 0.442 0.460 11.23 11.68 -D1 0.300 BSC 7.62 BSC -D2 0.150 BSC 3.81 BSC -D3 -0.460 E 0.442 0.460 11.23 11.68 2 11.68 -E1 0.300 BSC 7.62 BSC -E2 0.150 BSC 3.81 BSC -E3 -e 0.460 0.050 BSC
    0.015 -11.68
    1.27 BSC 0.38 2
    -2 h 0.040 REF 1.02 REF 5 j 0.020 REF 0.51 REF 5 L 0.045 0.055 1.14 1.40 -L1 0.045 0.055 1.14 1.40 -L2 0.075 0.095 1.90 2.41 -L3 0.003 0.015 0.08 0.038 -ND 7 7 3 NE 7 7 3 N 28 28 -F-3
    Rev. 0 5/18/94 B3 E1 E2 1.83 REF B3 e1 0.007 M E F S H S MILLIMETERS SYMBOL 1. Metallized castellations shall be connected to plane 1 terminals
    and extend toward plane 2 across at least two layers of ceramic
    or completely across all of the ceramic layers to make electrical
    connection with the optional plane 2 terminals. L2
    B2 L1
    D2 e1
    D1 NOTES: 2. Unless otherwise specified, a minimum clearance of 0.015 inch
    (0.38mm) shall be maintained between all metallized features
    (e.g., lid, castellations, terminals, thermal pads, etc.)
    3. Symbol “N” is the maximum number of terminals. Symbols “ND” ...

Parametrics

FamilyCLCC
Height max0.10 inch
Length0.45 inch
Package IndexJ28.A
Pin Count28
Pitch0.05 inch
Weight0.96 g
Width0.45 inch

Moldel Line

Series: CLCC (6)

Manufacturer's Classification

  • Hermetic Packages
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