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Package Intersil J3.A

Package Intersil J3.A

ManufacturerIntersil
SeriesCLCC
Part NumberJ3.A

3 Pad Hermetic SMD.5 Package Ceramic Bottom Terminal Chip Carrier

Package Outline Drawing (POD)

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    Hermetic Packages for Integrated Circuits
    Ceramic Leadless Chip Carrier Packages (CLCC)
    J3.A B D 3 PAD HERMETIC SMD.5 PACKAGE
    CERAMIC BOTTOM TERMINAL CHIP CARRIER
    INCHES E A
    TOP VIEW SYMBOL MIN MAX MIN MAX NOTES A 0.110 0.124 2.79 3.15 3 A1 0.010 0.020 0.25 0.51 -b 0.281 0.291 7.13 7.39 -b1 0.220 0.230 5.58 5.84 -b2 0.090 0.100 2.28 2.54 -b3 0.115 0.125 2.92 3.18 -D 0.395 0.405 10.03 10.28 -D1 0.030 -0.76 -E 0.291 0.301 7.39 7.64 -e
    A1 A C 1.91 BSC -NOTES:
    1. Controlling dimensions are in inches (mm for reference only).
    2. Dimensioning and tollorance per ANSI Y14.5M -1982 SIDE VIEW C 0.075 BSC Rev. 2 1/14 (3 PLCS)
    0.004 MILLIMETERS 3. The maximum “A” dimension is package height before being
    solder dipped.
    4. Patterned after MIL-STD-1835 CBCC1-N3 (C-B1) Note: Not
    meeting the Mil-Std “A” min. dimension of 0.112
    D1 b1 b3 (2 PLCS) 2
    3 e (2 PLCS) b
    1 b2
    0.014 M C A BOTTOM VIEW 1 (2 PLCS) ...

Parametrics

FamilyCLCC
Height max0.12 inch
Length0.40 inch
Package IndexJ3.A
Pin Count3
Pitch0.15 inch
Thickness0.12 inch
Weight0.91 g
Width0.30 inch

Moldel Line

Series: CLCC (6)

Manufacturer's Classification

  • Hermetic Packages

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