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Package Intersil J4.A

ManufacturerIntersil
SeriesCLCC
Part NumberJ4.A

4 Pin 9.0mmx4.7mm Hermetic Surface Mount Package

Package Outline Drawing (POD)

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    Hermetic Packages for Integrated Circuits Package Outline Drawing
    J4.A
    4 PIN 9.0mmx4.7mm HERMETIC SURFACE MOUNT PACKAGE
    Rev 0, 2/16
    #4
    GATE #3
    DRAIN 4.70 В±0.13 SOURCE
    #1 SUBSTRATE
    #2 1.82
    В±0.20 9.00 В±0.13
    PIN #1 INDEX AREA TOP VIEW END VIEW SIDE VIEW 0.50 В±0.07 (2x)
    SUBSTRATE
    #2 0.75 TYPICAL (REF) SOURCE
    #1 0.45 REF.
    x45В° 1.10 В±0.08 (2x) 0.70 В±0.08 #4
    GATE 1.90 В±0.08 (4x) #3
    DRAIN
    0.10 TYPICAL (REF) 5.90 В±0.08 (2x)
    BOTTOM VIEW NOTES:
    1. The corner shape (radius, chamfer, etc.) may vary at the manufacturers option from that shown on the drawing.
    2. The package thickness dimension is the package height before being solder dipped.
    3. Dimensions are in millimeters. 1 3.750 0.000 2.150 3.750 2.650 Hermetic Packages for Integrated Circuits 2.250 2.250
    #3 ...

Parametrics

FamilyCLCC
Height max0.08 inch
Length0.35 inch
Package IndexJ4.A
Pin Count4
Thickness0.07 inch
Weight0.29 g
Width0.19 inch

Moldel Line

Series: CLCC (6)

Manufacturer's Classification

  • Hermetic Packages

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