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Package Intersil R64.B

Package Intersil R64.B

ManufacturerIntersil
SeriesCQFP
Part NumberR64.B

64 Ceramic Quad Flatpack Package (CQFP) With E-Pad

Package Outline Drawing (POD)

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    Hermetic Packages for Integrated Circuits Package Outline Drawing
    R64.B
    64 CERAMIC QUAD FLATPACK PACKAGE (CQFP) WITH E-PAD
    Rev 2, 10/13
    1.118 (28.40)
    1.080 (27.43)
    0.567 (14.40)
    0.547 (13.90) 0.290 (7.37)
    0.255 (6.48)
    49 64 0.025 (0.635) BSC
    1 PIN 1
    INDEX AREA 48 0.567 (14.40)
    0.547 (13.90) 1.118 (28.40)
    1.080 (27.43) 0.010 (0.25)
    0.006 (0.15) 33 16
    17 32 TOP VIEW SEE DETAIL "A" 0.105 (2.67)
    0.075 (1.91) 0.0075 (0.188)
    0.005 (0.125) 0.008 (0.20)
    REF SIDE VIEW 0.380 (9.655)
    0.370 (9.395) DETAIL “A” 0.100 (2.537)
    0.085 (2.157) 0.359 (9.12)
    0.349 (8.86) METALIZED E-PAD
    [THICKNESS 0.003 (0.076) MAX] ...

Parametrics

FamilyCQFP
Length0.56 inch
Package IndexR64.B
Pin Count64
Weight1.428 g
Width0.56 inch

Moldel Line

Series: CQFP (6)

Manufacturer's Classification

  • Hermetic Packages
Slices ↓
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