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Package Intersil R64.C

ManufacturerIntersil
SeriesCQFP
Part NumberR64.C

64 CERAMIC QUAD FLATPACK PACKAGE (CQFP) WITH BOTTOM HEATSINK

Package Outline Drawing (POD)

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    Hermetic Packages for Integrated Circuits Package Outline Drawing
    R64.C
    64 CERAMIC QUAD FLATPACK PACKAGE (CQFP) WITH BOTTOM HEATSINK
    Rev 1, 10/13
    1.118 (28.40)
    1.080 (27.43)
    0.567 (14.40)
    0.547 (13.90) 0.290 (7.37)
    0.255 (6.48)
    64 0.025 (0.635) BSC
    1 49
    PIN 1
    INDEX AREA 48 0.567 (14.40)
    0.547 (13.90) 1.118 (28.40)
    1.080 (27.43) 0.010 (0.25)
    0.006 (0.15) 33 16
    17 32 SEE DETAIL "A" TOP VIEW 0.0075 (0.188)
    0.005 (0.125) 0.135 (3.43)
    0.111 (2.82) SIDE VIEW
    HEATSINK
    0.405 (10.29)
    0.395 (10.03)
    0.380 (9.655) ...

Parametrics

FamilyCQFP
Height max0.14 inch
Length0.56 inch
Package IndexR64.C
Pin Count64
Pitch0.03 inch
Weight2.65 g
Width0.56 inch

Moldel Line

Series: CQFP (6)

Manufacturer's Classification

  • Hermetic Packages
Slices ↓
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