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Package Intersil D20.3

Package Intersil D20.3

ManufacturerIntersil
SeriesSBDIP
Part NumberD20.3

Mil-Std-1835 CDIP2-T20(D-8,Config C)20 Lead Ceramic Dual-In-Line Metal Seal PKG

Package Outline Drawing (POD)

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    Hermetic Packages for Integrated Circuits
    Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
    D20.3 MIL-STD-1835 CDIP2-T20 (D-8, CONFIGURATION C) LEAD FINISH c1
    -A-20 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE
    METAL E b1
    M
    (b) M
    -Bbbb S C A -B S SECTION A-A D S D BASE
    PLANE Q S2
    -C-SEATING
    PLANE A
    L S1 eA A A b2
    b e eA/2 c aaa M C A -B S D S ccc M C A -B S D S NOTES:
    1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded
    area shown. The manufacturer’s identification shall not be used
    as a pin one identification mark.
    2. The maximum limits of lead dimensions b and c or M shall be
    measured at the centroid of the finished lead surfaces, when
    solder dip or tin plate lead finish is applied.
    3. Dimensions b1 and c1 apply to lead base metal only. Dimension
    M applies to lead plating and finish thickness.
    4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
    partial lead paddle. For this configuration dimension b3 replaces ...

Parametrics

FamilySBDIP
Height max0.20 inch
Length1.00 inch
Package IndexD20.3
Pin Count20
Pitch0.10 inch
Thickness0.10 inch
Weight1.85 g
Width0.30 inch

Moldel Line

Series: SBDIP (9)

Manufacturer's Classification

  • Hermetic Packages
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