Package Intersil W3x3.9H

ManufacturerIntersil
SeriesWLCSP
Part NumberW3x3.9H
Package Intersil W3x3.9H

9 Ball 3x3 Array Ultra Thin Wafer Level Chip Scale Package (WLCSP) 0.4mm Pitch

Package Outline Drawing (POD)

PDF, 153 Kb
Docket

Parametrics

FamilyWLCSP-BP
Pin Count9
Length1.45 mm
Width1.45 mm
Thickness0.28 mm
Height max0.32 mm
Pitch0.40 mm
Lead Free Peak Temperature260 °C
Package IndexW3X3.9H

Model Line

Manufacturer's Classification