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Package Intersil W3x3.9H

ManufacturerIntersil
SeriesWLCSP
Part NumberW3x3.9H

9 Ball 3x3 Array Ultra Thin Wafer Level Chip Scale Package (WLCSP) 0.4mm Pitch

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    1. Package Outline Drawing W3x3.9H
    9 BALL 3x3 ARRAY ULTRA THIN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) 0.4mm Pitch
    Rev 2, 11/17
    X
    1.410 В±0.030 Y 0.400 C
    1.410 В±0.030 (9x) 0.240 В±0.035 B 0.305 A
    (4x) 0.10
    1 PIN 1 2 3 (A1 CORNER) TOP VIEW 0.305
    BOTTOM VIEW Z
    0.05 Z PACKAGE OUTLINE SEATING PLANE
    3 0.215 0.400 0.240 В±0.035 4 0.265 0.10 M Z X Y
    0.05 M Z
    5 6. NSMD RECOMMENDED LAND PATTERN 0.130 В±0.015
    0.150 В±0.025
    SIDE VIEW NOTES:
    1. All dimensions are in millimeters.
    2. Dimensions and tolerance per ASME Y14.5 -1994.
    3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
    4. Dimension is measured at the maximum bump diameter parallel to primary datum Z .
    5. Bump position designation per JESD 95-1, SPP-010.
    6. NSMD refers to non-solder mask defined pad design per Intersil tech brief TB451. ...
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