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Package Intersil W3x5.15

Package Intersil W3x5.15

ManufacturerIntersil
SeriesWLCSP
Part NumberW3x5.15

15 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm pitch)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W3x5.15
    15 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm pitch)
    Rev 1, 6/14 X 1.51В±0.030 0.800 Y 0.400
    E
    15X 0.265В±0.035
    2.15В±0.030 D
    1.600 C
    B (4X) 0.275 A 0.10 1 2 3 PIN 1
    (A1 CORNER) 0.355 TOP VIEW BOTTOM VIEW Z
    PACKAGE OUTLINE 0.05 Z SEATING PLANE
    3 0.240
    0.290
    0.400
    0.265В±0.035 15X
    0.10 M Z X Y
    0.05 M Z 0.200В±0.030
    0.500В±0.050 RECOMMENDED LAND PATTERN SIDE VIEW NOTES:
    1. Dimensions and tolerance per ASME Y 14.5M -1994.
    2. Dimension is measured at the maximum bump diameter
    parallel to primary datum Z .
    3. Primary datum Z and seating plane are defined by the spherical
    crowns of the bump. ...
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