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Package Intersil W5x8.40

Package Intersil W5x8.40

ManufacturerIntersil
SeriesWLCSP
Part NumberW5x8.40

40 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    W5x8.40
    40 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)
    Rev 0, 10/13 X 2.010 В± 0.030
    1.600 Y
    H
    40x 0.265 В±0.035 G
    F
    E 3.270 В± 0.030 2.800 D
    C
    0.235 B
    A
    (4X) 1 2 0.10
    PIN 1
    (A1 CORNER)
    TOP VIEW 0.205 BOTTOM VIEW PACKAGE OUTLINE 0.240 3 4 5 0.400 0.05 Z Z SEATING PLANE
    3 0.290 0.400 0.265 В±0.035 40x
    0.10
    0.05 ZXY
    Z 0.200В±0.030
    TYPICAL RECOMMENDED LAND PATTERN 0.500В±0.050
    SIDE VIEW NOTES:
    1. Dimensions and tolerance per ASME Y14.5M -1994. ...
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