Datasheet MCP6441, MCP6442, MCP6444 (Microchip)

ManufacturerMicrochip
DescriptionThe MCP6441 device is a single nanopower operational amplifier (op amp), which has low quiescent current (450 nA, typical) and rail-to-rail input and output operation
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MCP6441/2/4. 450 nA, 9 kHz Op Amp. Features:. Description:. Applications:. Typical Application. Design Aids:. MCP6441

Datasheet MCP6441, MCP6442, MCP6444 Microchip

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MCP6441/2/4 450 nA, 9 kHz Op Amp Features: Description:
• Low Quiescent Current: 450 nA (typical) The MCP6441/2/4 device is a single nanopower • Gain Bandwidth Product: 9 kHz (typical) operational amplifier (op amp), which has low quiescent current (450 nA, typical) and rail-to-rail input • Supply Voltage Range: 1.4V to 6.0V and output operation. This op amp is unity gain stable • Rail-to-Rail Input and Output and has a gain bandwidth product of 9 kHz (typical). • Unity Gain Stable These devices operate with a single supply voltage as • Slew Rate: 3V/ms (typical) low as 1.4V. These features make the family of op • Extended Temperature Range: -40°C to +125°C amps well suited for single-supply, battery-powered applications. • No Phase Reversal • Small Packages The MCP6441/2/4 op amp is designed with Microchip’s advanced CMOS process and offered in single
Applications:
(MCP6441), dual (MCP6442), and quad (MCP6444) configurations. All devices are available in the • Portable Equipment extended temperature range, with a power supply • Battery Powered System range of 1.4V to 6.0V. • Data Acquisition Equipment
Typical Application
• Sensor Conditioning • Battery Current Sensing IDD To load • Analog Active Filters 1.4V V 10Ω DD to
Design Aids:
VOUT 6.0V 100 kΩ
MCP6441
• SPICE Macro Models • FilterLab® Software 1 MΩ • Microchip Advanced Part Selector (MAPS) • Analog Demonstration and Evaluation Boards V – V DD OUT • Application Notes I = --------------------- DD (10 V/V) ⋅ (10Ω)
Battery Current Sensing Package Types MCP6441 MCP6442 MCP6442 MCP6444
SC70-5, SOT-23-5 SOIC, MSOP 2x3 TDFN * SOIC, TSSOP V 1 5 V V V V 1 8 V V 1 OUT 14 V DD 1 8 DD OUTA OUTA DD OUTA OUTD V 2 VINA– V V 2 13 V SS 2 7 OUTB INA– V 2 EP 7 V IND– IN– OUTB V 3 4 V V 6 9 V 3 12 V IN+ IN– IN+ 3 VIN– IN+ IND+ VIN+ 3 6 VINB– V V 4 11 V SS 4 5 VINB+ DD SS VSS 4 5 VINB+ VINB+ 5 10 VINC+ VINB– 6 9 VINC– VOUTB 7 8 V * Includes Exposed Thermal Pad (EP); see Table 3-1. OUTC © 2010-2012 Microchip Technology Inc. DS22257C-page 1 Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 6.0V. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 1.4V. FIGURE 2-5: Input Offset Voltage vs. Output Voltage. FIGURE 2-6: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-7: Input Noise Voltage Density vs. Frequency. FIGURE 2-8: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-9: CMRR, PSRR vs. Frequency. FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-11: Input Bias, Offset Current vs. Ambient Temperature. FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-13: Quiescent Current vs. Ambient Temperature. FIGURE 2-14: Quiescent Current vs. Power Supply Voltage. FIGURE 2-15: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-16: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-17: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-18: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-19: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-20: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-21: Output Voltage Swing vs. Frequency. FIGURE 2-22: Output Voltage Headroom vs. Output Current. FIGURE 2-23: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-24: Slew Rate vs. Ambient Temperature. FIGURE 2-25: Small Signal Non-Inverting Pulse Response. FIGURE 2-26: Small Signal Inverting Pulse Response. FIGURE 2-27: Large Signal Non-Inverting Pulse Response. FIGURE 2-28: Large Signal Inverting Pulse Response. FIGURE 2-29: The MCP6441/2/4 Device Shows No Phase Reversal. FIGURE 2-30: Closed Loop Output Impedance vs. Frequency. FIGURE 2-31: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-32: Channel-to-Channel Separation vs. Frequency (MCP6442/4 only). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 4.0 Application Information FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. FIGURE 4-6: Example Guard Ring Layout for Inverting Gain. FIGURE 4-7: Battery Current Sensing. FIGURE 4-8: Precision Half-Wave Rectifier. FIGURE 4-9: Two Op Amp Instrumentation Amplifier. 5.0 Design Aids 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service
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