Datasheet AD8691, AD8692, AD8694 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | Low Cost, Low Noise, CMOS Rail-to-Rail Output Quad Op Amp |
| Pages / Page | 16 / 5 — Data Sheet. AD8691/AD8692/AD8694. ABSOLUTE MAXIMUM RATINGS. THERMAL … |
| Revision | F |
| File Format / Size | PDF / 317 Kb |
| Document Language | English |
Data Sheet. AD8691/AD8692/AD8694. ABSOLUTE MAXIMUM RATINGS. THERMAL CHARACTERISTICS. Table 3. Parameter. Rating
Model Line for this Datasheet
Text Version of Document
Data Sheet AD8691/AD8692/AD8694 ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL CHARACTERISTICS Table 3.
θJA is specified for the worst-case conditions, that is, the device
Parameter Rating
soldered in the circuit board for surface-mount packages. Supply Voltage 6 V
Table 4. Thermal Resistance
Input Voltage VSS − 0.3 V to VDD + 0.3 V
Package Type θJA θJC Unit
Differential Input Voltage ±6 V 8-Lead MSOP (RM-8) 210 45 °C/W Output Short-Circuit Duration Observe derating curves 8-Lead SOIC (R-8) 158 43 °C/W to GND 5-Lead TSOT (UJ-5) 207 61 °C/W Storage Temperature Range −65°C to +150°C 5-Lead SC70 (KS-5) 376 126 °C/W Operating Temperature Range −40°C to +125°C 14-Lead TSSOP (RU-14) 180 35 °C/W Junction Temperature Range −65°C to +150°C 14-Lead SOIC (R-14) 120 36 °C/W Lead Temperature 300°C (Soldering, 60 sec)
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. F | Page 5 of 16 Document Outline Features Applications General Description Pin Configurations Table of Contents Revision History Specifications Electrical Characteristics Absolute Maximum Ratings Thermal Characteristics ESD Caution Typical Performance Characteristics Outline Dimensions Ordering Guide Automotive Products
TA = 25°C, unless otherwise noted.
THERMAL CHARACTERISTICS Table 3.
θJA is specified for the worst-case conditions, that is, the device
Parameter Rating
soldered in the circuit board for surface-mount packages. Supply Voltage 6 V
Table 4. Thermal Resistance
Input Voltage VSS − 0.3 V to VDD + 0.3 V
Package Type θJA θJC Unit
Differential Input Voltage ±6 V 8-Lead MSOP (RM-8) 210 45 °C/W Output Short-Circuit Duration Observe derating curves 8-Lead SOIC (R-8) 158 43 °C/W to GND 5-Lead TSOT (UJ-5) 207 61 °C/W Storage Temperature Range −65°C to +150°C 5-Lead SC70 (KS-5) 376 126 °C/W Operating Temperature Range −40°C to +125°C 14-Lead TSSOP (RU-14) 180 35 °C/W Junction Temperature Range −65°C to +150°C 14-Lead SOIC (R-14) 120 36 °C/W Lead Temperature 300°C (Soldering, 60 sec)
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. F | Page 5 of 16 Document Outline Features Applications General Description Pin Configurations Table of Contents Revision History Specifications Electrical Characteristics Absolute Maximum Ratings Thermal Characteristics ESD Caution Typical Performance Characteristics Outline Dimensions Ordering Guide Automotive Products
