Datasheet LT3580 (Analog Devices) - 26
| Manufacturer | Analog Devices |
| Description | Boost/Inverting DC/DC Converter with 2A Switch, Soft-Start, and Synchronization |
| Pages / Page | 28 / 26 — PACKAGE DESCRIPTION. MS8E Package. 8-Lead Plastic MSOP, Exposed Die Pad. … |
| File Format / Size | PDF / 302 Kb |
| Document Language | English |
PACKAGE DESCRIPTION. MS8E Package. 8-Lead Plastic MSOP, Exposed Die Pad. NO MEASUREMENT PURPOSE
Model Line for this Datasheet
- LT3580EDD#PBF LT3580EDD#PBF LT3580EDD#TRPBF LT3580EDD#TRPBF LT3580EMS8E#PBF LT3580EMS8E#PBF LT3580EMS8E#TRPBF LT3580EMS8E#TRPBF LT3580HMS8E#PBF LT3580HMS8E#PBF LT3580HMS8E#TRPBF LT3580HMS8E#TRPBF LT3580IDD#PBF LT3580IDD#PBF LT3580IDD#TRPBF LT3580IDD#TRPBF LT3580IMS8E#PBF LT3580IMS8E#PBF LT3580IMS8E#TRPBF LT3580IMS8E#TRPBF LT3580MPMS8E#PBF LT3580MPMS8E#PBF LT3580MPMS8E#TRPBF LT3580MPMS8E#TRPBF
Text Version of Document
LT3580
PACKAGE DESCRIPTION MS8E Package 8-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1662 Rev F) BOTTOM VIEW OF EXPOSED PAD OPTION 1.88 1 (.074) 0.29 1.68 REF 1.88 p 0.102 0.889 p 0.127 (.066) (.074 p .004) (.035 p .005) 0.05 REF 5.23 DETAIL “B” (.206) 1.68 p 0.102 3.20 – 3.45 CORNER TAIL IS PART OF MIN (.066 p .004) (.126 – .136) DETAIL “B” THE LEADFRAME FEATURE. FOR REFERENCE ONLY 8
NO MEASUREMENT PURPOSE
3.00 p 0.102 (.118 0.65 p .004) 0.52 0.42 p 0.038 (.0165 p .0015) (.0256) (NOTE 3) 8 7 6 5 (.0205) TYP BSC REF RECOMMENDED SOLDER PAD LAYOUT 3.00 p 0.102 4.90 p 0.152 DETAIL “A” (.118 p .004) 0.254 (.193 p .006) (NOTE 4) (.010) 0o – 6o TYP GAUGE PLANE 1 2 3 4 0.53 p 0.152 (.021 p .006) 1.10 0.86 (.043) (.034) DETAIL “A” MAX REF 0.18 (.007) SEATING PLANE 0.22 – 0.38 0.1016 p 0.0508 (.009 – .015) (.004 p .002) 0.65 TYP MSOP (MS8E) 0210 REV F (.0256) NOTE: BSC 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 6. EXPOSED PAD DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL NOT EXCEED 0.254mm (.010") PER SIDE. 3580fg 26
PACKAGE DESCRIPTION MS8E Package 8-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1662 Rev F) BOTTOM VIEW OF EXPOSED PAD OPTION 1.88 1 (.074) 0.29 1.68 REF 1.88 p 0.102 0.889 p 0.127 (.066) (.074 p .004) (.035 p .005) 0.05 REF 5.23 DETAIL “B” (.206) 1.68 p 0.102 3.20 – 3.45 CORNER TAIL IS PART OF MIN (.066 p .004) (.126 – .136) DETAIL “B” THE LEADFRAME FEATURE. FOR REFERENCE ONLY 8
NO MEASUREMENT PURPOSE
3.00 p 0.102 (.118 0.65 p .004) 0.52 0.42 p 0.038 (.0165 p .0015) (.0256) (NOTE 3) 8 7 6 5 (.0205) TYP BSC REF RECOMMENDED SOLDER PAD LAYOUT 3.00 p 0.102 4.90 p 0.152 DETAIL “A” (.118 p .004) 0.254 (.193 p .006) (NOTE 4) (.010) 0o – 6o TYP GAUGE PLANE 1 2 3 4 0.53 p 0.152 (.021 p .006) 1.10 0.86 (.043) (.034) DETAIL “A” MAX REF 0.18 (.007) SEATING PLANE 0.22 – 0.38 0.1016 p 0.0508 (.009 – .015) (.004 p .002) 0.65 TYP MSOP (MS8E) 0210 REV F (.0256) NOTE: BSC 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 6. EXPOSED PAD DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL NOT EXCEED 0.254mm (.010") PER SIDE. 3580fg 26