Datasheet ADL5565 (Analog Devices) - 10

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Data Sheet ADL5565 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3. Parameter Rating
Table 4 lists the junction-to-air thermal resistance (θJA) and the Output Voltage Swing × Bandwidth Product

2000 V p-p MHz

junction-to-paddle thermal resistance (θJC) for the ADL5565. Supply Voltage, VCC 5.25 V
Table 4. Thermal Resistance
VIPx, VINx VCC + 0.5 V
Package Type θ 1 2 JA θJC Unit
±IOUT Maximum 30 mA 16 LFCSP 60 12 °C/W Internal Power Dissipation 525 mW 1 Measured on Analog Devices evaluation board. For more information about Maximum Junction Temperature 125°C board layout, see the Soldering Information and Recommended PCB Land Operating Temperature Range −40°C to +100°C Pattern section. 2 Based on simulation with JEDEC standard JESD51. Storage Temperature Range −65°C to +150°C
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. E | Page 9 of 28 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications 3.3 V Specifications 5 V Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Circuit Description Basic Structure Applications information Basic Connections Input and Output Interfacing Single-Ended Input to Differential Output Gain Adjustment and Interfacing ADC Interfacing Layout Considerations Soldering Information and Recommended PCB Land Pattern Evaluation Board Outline Dimensions Ordering Guide