Datasheet MCP6031, MCP6032, MCP6035, MCP6034 (Microchip)
| Manufacturer | Microchip |
| Description | The MCP6031 operational amplifier (op amp) has a gain bandwidth of 10 kHz with a low typical operating current of 900 nA and an offset voltage that is less than 150 uV |
| Pages / Page | 34 / 1 — MCP6031/2/3/4. 0.9 µA, High Precision Op Amps. Features. Description. … |
| File Format / Size | PDF / 652 Kb |
| Document Language | English |
MCP6031/2/3/4. 0.9 µA, High Precision Op Amps. Features. Description. Applications. Design Aids. Package Types. MCP6031. MCP6033
Model Line for this Datasheet
- MCP6031-E/MC MCP6031-E/MS MCP6031-E/P MCP6031-E/SN MCP6031T-E/MC MCP6031T-E/MS MCP6031T-E/OT MCP6031T-E/OTVAO MCP6031T-E/SN
Text Version of Document
MCP6031/2/3/4 0.9 µA, High Precision Op Amps Features Description
• Rail-to-Rail Input and Output The Microchip Technology Inc. MCP6031/2/3/4 family • Low Offset Voltage: ±150 µV (maximum) of operational amplifiers (op amps) operate with a • Ultra Low Quiescent Current: 0.9 µA (typical) single supply voltage as low as 1.8V, while drawing ultra low quiescent current per amplifier (0.9 µA, • Wide Power Supply Voltage: 1.8V to 5.5V typical). This family also has low input offset voltage • Gain Bandwidth Product: 10 kHz (typical) (±150 µV, maximum) and rail-to-rail input and output • Unity Gain Stable operation. This combination of features supports • Chip Select (CS) capability: MCP6033 battery-powered and portable applications. • Extended Temperature Range: The MCP6031/2/3/4 family is unity gain stable and has - -40°C to +125°C a gain bandwidth product of 10 kHz (typical). These • No Phase Reversal specs make these op amps appropriate for low fre- quency applications, such as battery current
Applications
monitoring and sensor conditioning. The MCP6031/2/3/4 family is offered in single • Toll Booth Tags (MCP6031), single with power saving Chip Select (CS) • Wearable Products input (MCP6033), dual (MCP6032), and quad • Battery Current Monitoring (MCP6034) configurations. • Sensor Conditioning The MCP6031/2/3/4 family is designed with Micro- • Battery Powered chip’s advanced CMOS process. All devices are available in the extended temperature range, with a
Design Aids
power supply range of 1.8V to 5.5V. • SPICE Macro Models
Package Types
• FilterLab® Software
MCP6031 MCP6033
• Mindi™ Circuit Designer & Simulator
DFN, SOIC, MSOP DFN, SOIC, MSOP
• MAPS (Microchip Advanced Part Selector) NC 1 8 NC NC 1 8 CS • Analog Demonstration and Evaluation Boards V 2 7 V V 2 7 V • Application Notes IN– DD IN– DD VIN+ 3 6 VOUT VIN+ 3 6 VOUT
Typical Application
VSS 4 5 NC VSS 4 5 NC I
MCP6031 MCP6034
DD VDD SOT-23-5
SOIC, TSSOP
1.4V 10Ω V 1 14 VOUTD to V 1 5 V OUTA OUT DD VOUT 5.5V V 2 V 2 13 V INA– IND– SS
MCP6031
100 kΩ 3 4 V V V INA+ 3 12 VIND+ IN+ IN– V V DD 4 11 SS 1 MΩ
MCP6032
VINB+ 5 10 VINC+
SOIC, MSOP
VINB– 6 9 VINC– V – V V 1 8 V OUTA DD V I DD OUT = --------------------- OUTB 7 8 VOUTC DD (10 V/V) ⋅ (10Ω) V 2 7 V INA– OUTB
High Side Battery Current Sensor
VINA+ 3 6 VINB– V V SS 4 5 INB+ © 2008 Microchip Technology Inc. DS22041B-page 1 Document Outline 1.0 Electrical Characteristics FIGURE 1-1: Timing Diagram for the CS Pin on the MCP6033. 1.1 Test Circuits FIGURE 1-2: AC and DC Test Circuit for Most Non-Inverting Gain Conditions. FIGURE 1-3: AC and DC Test Circuit for Most Inverting Gain Conditions. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage with VDD = 3.0V. FIGURE 2-2: Input Offset Voltage Drift with VDD = 3.0V and TA £ +85˚C. FIGURE 2-3: Input Offset Voltage Drift with VDD = 3.0V and TA ³ +85˚C. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 5.5V. FIGURE 2-5: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 1.8V. FIGURE 2-6: Input Offset Voltage vs. Output Voltage. FIGURE 2-7: Input Noise Voltage Density vs. Frequency. FIGURE 2-8: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-9: Common Mode Rejection Ratio, Power Supply Rejection Ratio vs. Frequency. FIGURE 2-10: Common Mode Rejection Ratio, Power Supply Rejection Ratio vs. Ambient Temperature. FIGURE 2-11: Input Bias, Offset Currents vs. Ambient Temperature. FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-13: Quiescent Current vs Ambient Temperature. FIGURE 2-14: Quiescent Current vs. Power Supply Voltage with VCM = VDD. FIGURE 2-15: Quiescent Current vs. Power Supply Voltage with VCM = VSS. FIGURE 2-16: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-17: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-18: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-19: Channel-to-Channel Separation vs. Frequency ( MCP6032/4 only). FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Common Mode Input Voltage. FIGURE 2-21: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-22: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-23: Ouput Short Circuit Current vs. Power Supply Voltage. FIGURE 2-24: Output Voltage Swing vs. Frequency. FIGURE 2-25: Output Voltage Headroom vs. Output Current. FIGURE 2-26: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-27: Slew Rate vs. Ambient Temperature. FIGURE 2-28: Small Signal Non-Inverting Pulse Response. FIGURE 2-29: Small Signal Inverting Pulse Response. FIGURE 2-30: Large Signal Non-Inverting Pulse Response. FIGURE 2-31: Large Signal Inverting Pulse Response. FIGURE 2-32: The MCP6031/2/3/4 family shows no phase reversal . FIGURE 2-33: Chip Select (CS) to Amplifier Output Response Time (MCP6033 only). FIGURE 2-34: Chip Select (CS) Hysteresis (MCP6033 only) with VDD = 5.5V. FIGURE 2-35: Chip Select (CS) Hysteresis (MCP6033 only) with VDD = 3.0V. FIGURE 2-36: Chip Select (CS) Hysteresis (MCP6033 only) with VDD = 1.8V. FIGURE 2-37: Closed Loop Output Impedance vs. Frequency. FIGURE 2-38: Measured Input Current vs. Input Voltage (below VSS). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Chip Select Digital Input 3.4 Power Supply Pins 4.0 Application Information 4.1 Rail-to-Rail Input FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Output Loads and Battery Life 4.4 Capacitive Loads FIGURE 4-3: Output resistor, RISO stabilizes large capacitive loads. FIGURE 4-4: Recommended RISO values for Capacitive Loads. 4.5 MCP6033 Chip Select 4.6 Supply Bypass 4.7 Unused Op Amps FIGURE 4-5: Unused Op Amps. 4.8 PCB Surface Leakage FIGURE 4-6: Example Guard Ring Layout for Inverting Gain. 4.9 Application Circuits FIGURE 4-7: High Side Battery Current Sensor. FIGURE 4-8: Precision, Non-inverting Comparator. FIGURE 4-9: Driving the MCP3421 using an R-C Snubber. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Mindi™ Circuit Designer & Simulator 5.4 MAPS (Microchip Advanced Part Selector) 5.5 Analog Demonstration and Evaluation Boards 5.6 Application Notes 6.0 Packaging Information 6.1 Package Marking Information
• Rail-to-Rail Input and Output The Microchip Technology Inc. MCP6031/2/3/4 family • Low Offset Voltage: ±150 µV (maximum) of operational amplifiers (op amps) operate with a • Ultra Low Quiescent Current: 0.9 µA (typical) single supply voltage as low as 1.8V, while drawing ultra low quiescent current per amplifier (0.9 µA, • Wide Power Supply Voltage: 1.8V to 5.5V typical). This family also has low input offset voltage • Gain Bandwidth Product: 10 kHz (typical) (±150 µV, maximum) and rail-to-rail input and output • Unity Gain Stable operation. This combination of features supports • Chip Select (CS) capability: MCP6033 battery-powered and portable applications. • Extended Temperature Range: The MCP6031/2/3/4 family is unity gain stable and has - -40°C to +125°C a gain bandwidth product of 10 kHz (typical). These • No Phase Reversal specs make these op amps appropriate for low fre- quency applications, such as battery current
Applications
monitoring and sensor conditioning. The MCP6031/2/3/4 family is offered in single • Toll Booth Tags (MCP6031), single with power saving Chip Select (CS) • Wearable Products input (MCP6033), dual (MCP6032), and quad • Battery Current Monitoring (MCP6034) configurations. • Sensor Conditioning The MCP6031/2/3/4 family is designed with Micro- • Battery Powered chip’s advanced CMOS process. All devices are available in the extended temperature range, with a
Design Aids
power supply range of 1.8V to 5.5V. • SPICE Macro Models
Package Types
• FilterLab® Software
MCP6031 MCP6033
• Mindi™ Circuit Designer & Simulator
DFN, SOIC, MSOP DFN, SOIC, MSOP
• MAPS (Microchip Advanced Part Selector) NC 1 8 NC NC 1 8 CS • Analog Demonstration and Evaluation Boards V 2 7 V V 2 7 V • Application Notes IN– DD IN– DD VIN+ 3 6 VOUT VIN+ 3 6 VOUT
Typical Application
VSS 4 5 NC VSS 4 5 NC I
MCP6031 MCP6034
DD VDD SOT-23-5
SOIC, TSSOP
1.4V 10Ω V 1 14 VOUTD to V 1 5 V OUTA OUT DD VOUT 5.5V V 2 V 2 13 V INA– IND– SS
MCP6031
100 kΩ 3 4 V V V INA+ 3 12 VIND+ IN+ IN– V V DD 4 11 SS 1 MΩ
MCP6032
VINB+ 5 10 VINC+
SOIC, MSOP
VINB– 6 9 VINC– V – V V 1 8 V OUTA DD V I DD OUT = --------------------- OUTB 7 8 VOUTC DD (10 V/V) ⋅ (10Ω) V 2 7 V INA– OUTB
High Side Battery Current Sensor
VINA+ 3 6 VINB– V V SS 4 5 INB+ © 2008 Microchip Technology Inc. DS22041B-page 1 Document Outline 1.0 Electrical Characteristics FIGURE 1-1: Timing Diagram for the CS Pin on the MCP6033. 1.1 Test Circuits FIGURE 1-2: AC and DC Test Circuit for Most Non-Inverting Gain Conditions. FIGURE 1-3: AC and DC Test Circuit for Most Inverting Gain Conditions. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage with VDD = 3.0V. FIGURE 2-2: Input Offset Voltage Drift with VDD = 3.0V and TA £ +85˚C. FIGURE 2-3: Input Offset Voltage Drift with VDD = 3.0V and TA ³ +85˚C. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 5.5V. FIGURE 2-5: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 1.8V. FIGURE 2-6: Input Offset Voltage vs. Output Voltage. FIGURE 2-7: Input Noise Voltage Density vs. Frequency. FIGURE 2-8: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-9: Common Mode Rejection Ratio, Power Supply Rejection Ratio vs. Frequency. FIGURE 2-10: Common Mode Rejection Ratio, Power Supply Rejection Ratio vs. Ambient Temperature. FIGURE 2-11: Input Bias, Offset Currents vs. Ambient Temperature. FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-13: Quiescent Current vs Ambient Temperature. FIGURE 2-14: Quiescent Current vs. Power Supply Voltage with VCM = VDD. FIGURE 2-15: Quiescent Current vs. Power Supply Voltage with VCM = VSS. FIGURE 2-16: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-17: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-18: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-19: Channel-to-Channel Separation vs. Frequency ( MCP6032/4 only). FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Common Mode Input Voltage. FIGURE 2-21: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-22: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-23: Ouput Short Circuit Current vs. Power Supply Voltage. FIGURE 2-24: Output Voltage Swing vs. Frequency. FIGURE 2-25: Output Voltage Headroom vs. Output Current. FIGURE 2-26: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-27: Slew Rate vs. Ambient Temperature. FIGURE 2-28: Small Signal Non-Inverting Pulse Response. FIGURE 2-29: Small Signal Inverting Pulse Response. FIGURE 2-30: Large Signal Non-Inverting Pulse Response. FIGURE 2-31: Large Signal Inverting Pulse Response. FIGURE 2-32: The MCP6031/2/3/4 family shows no phase reversal . FIGURE 2-33: Chip Select (CS) to Amplifier Output Response Time (MCP6033 only). FIGURE 2-34: Chip Select (CS) Hysteresis (MCP6033 only) with VDD = 5.5V. FIGURE 2-35: Chip Select (CS) Hysteresis (MCP6033 only) with VDD = 3.0V. FIGURE 2-36: Chip Select (CS) Hysteresis (MCP6033 only) with VDD = 1.8V. FIGURE 2-37: Closed Loop Output Impedance vs. Frequency. FIGURE 2-38: Measured Input Current vs. Input Voltage (below VSS). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Chip Select Digital Input 3.4 Power Supply Pins 4.0 Application Information 4.1 Rail-to-Rail Input FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Output Loads and Battery Life 4.4 Capacitive Loads FIGURE 4-3: Output resistor, RISO stabilizes large capacitive loads. FIGURE 4-4: Recommended RISO values for Capacitive Loads. 4.5 MCP6033 Chip Select 4.6 Supply Bypass 4.7 Unused Op Amps FIGURE 4-5: Unused Op Amps. 4.8 PCB Surface Leakage FIGURE 4-6: Example Guard Ring Layout for Inverting Gain. 4.9 Application Circuits FIGURE 4-7: High Side Battery Current Sensor. FIGURE 4-8: Precision, Non-inverting Comparator. FIGURE 4-9: Driving the MCP3421 using an R-C Snubber. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Mindi™ Circuit Designer & Simulator 5.4 MAPS (Microchip Advanced Part Selector) 5.5 Analog Demonstration and Evaluation Boards 5.6 Application Notes 6.0 Packaging Information 6.1 Package Marking Information
