Datasheet MCP6N11 (Microchip) - 4

ManufacturerMicrochip
Description500 kHz, 800 µA Instrumentation Amplifier
Pages / Page50 / 4 — MCP6N11. TABLE 1-1:. DC ELECTRICAL SPECIFICATIONS (CONTINUED). Electrical …
File Format / SizePDF / 5.8 Mb
Document LanguageEnglish

MCP6N11. TABLE 1-1:. DC ELECTRICAL SPECIFICATIONS (CONTINUED). Electrical Characteristics:. Parameters. Sym. Min. Typ. Max. Units. GMIN

MCP6N11 TABLE 1-1: DC ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Parameters Sym Min Typ Max Units GMIN

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MCP6N11 TABLE 1-1: DC ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics:
Unless otherwise indicated, TA = +25°C, VDD = 1.8V to 5.5V, VSS = GND, EN/CAL = VDD, VCM = VDD/2, VDM = 0V, VREF = VDD/2, VL = VDD/2, RL = 10 kΩ to VL and GDM = GMIN; see Figure 1-6 and Figure 1-7.
Parameters Sym Min Typ Max Units GMIN Conditions Input Current and Impedance (Note 4)
Input Bias Current IB — 10 — pA all Across Temperature — 80 — pA TA= +85°C Across Temperature 0 2 5 nA TA= +125°C Input Offset Current IOS — ±1 — pA Across Temperature — ±5 — pA TA= +85°C Across Temperature -1 ±0.05 +1 nA TA= +125°C Common Mode Input ZCM — 1013||6 — Ω||pF Impedance Differential Input ZDIFF — 1013||3 — Ω||pF Impedance
Input Common Mode Voltage (VCM or VREF) (Note 4 )
Input Voltage Range VIVL — — VSS − 0.2 V all
(Note 5 , Note 6 )
VIVH VDD + 0.15 — — V Common Mode CMRR 62 79 — dB 1 VCM = VIVL to VIVH, Rejection Ratio VDD = 1.8V 69 87 — dB 2 75 101 — dB 5 79 107 — dB 10 86 119 — dB 100 70 94 — dB 1 VCM = VIVL to VIVH, VDD = 5.5V 78 100 — dB 2 80 108 — dB 5 81 114 — dB 10 88 115 — dB 100 Common Mode INLCM -1000 ±115 +1000 ppm 1 VCM = VIVL to VIVH, Non-Linearity V -570 ±27 +570 ppm 2 DM = 0V, VDD = 1.8V
(Note 7)
-230 ±11 +230 ppm 5 -125 ±6 +125 ppm 10 -50 ±2 +50 ppm 100 -400 ±42 +400 ppm 1 VCM = VIVL to VIVH, V -220 ±10 +220 ppm 2 DM = 0V, VDD = 5.5V
(Note 7)
-100 ±4 +100 ppm 5 -50 ±2 +50 ppm 10 -30 ±1 +30 ppm 100
Note 1:
VCM = (VIP + VIM) / 2, VDM = (VIP – VIM) and GDM = 1 + RF/RG.
2:
The VOS spec limits include 1/f noise effects.
3:
This is the input offset drift without VOS re-calibration; toggle EN/CAL to minimize this effect.
4:
These specs apply to both the VIP, VIM input pair (use VCM) and to the VREF, VFG input pair (VREF takes VCM’s place).
5:
This spec applies to the VIP, VIM, VREF and VFG pins individually.
6:
Figure 2-11 and Figure 2-19 show the VIVR and VDMR variation over temperature.
7:
See
Section 1.5 “Explanation of DC Error Specs”.
DS25073A-page 4 © 2011 Microchip Technology Inc. Document Outline 500 kHz, 800 µA Instrumentation Amplifier TABLE 1: Key Differentiating Specifications 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Specifications TABLE 1-1: DC Electrical Specifications TABLE 1-2: AC Electrical Specifications TABLE 1-3: Digital Electrical Specifications TABLE 1-4: Temperature Specifications 1.3 Timing Diagrams FIGURE 1-1: Common Mode Input Overdrive Recovery Timing Diagram. FIGURE 1-2: Differential Mode Input Overdrive Recovery Timing Diagram. FIGURE 1-3: Output Overdrive Recovery Timing Diagram. FIGURE 1-4: POR Timing Diagram. FIGURE 1-5: EN/CAL Timing Diagram. 1.4 DC Test Circuits FIGURE 1-6: Test Circuit for Common Mode (Input Offset). TABLE 1-5: Selecting RF and RG FIGURE 1-7: Test Circuit for Differential Mode. TABLE 1-6: Selecting RF and RG 1.5 Explanation of DC Error Specs FIGURE 1-8: Input Offset Error vs. Common Mode Input Voltage. FIGURE 1-9: Differential Input Error vs. Differential Input Voltage. 2.0 Typical Performance Curves 2.1 DC Voltages and Currents FIGURE 2-1: Normalized Input Offset Voltage, with GMIN = 1 to 10. FIGURE 2-2: Normalized Input Offset Voltage, with GMIN = 100. FIGURE 2-3: Normalized Input Offset Voltage Drift, with GMIN = 1 to 10. FIGURE 2-4: Normalized Input Offset Voltage Drift, with GMIN = 100. FIGURE 2-5: Normalized Input Offset Voltage vs. Power Supply Voltage, with VCM = 0V and GMIN = 1 to 10. FIGURE 2-6: Normalized Input Offset Voltage vs. Power Supply Voltage, with VCM = 0V and GMIN = 100. FIGURE 2-7: Normalized Input Offset Voltage vs. Power Supply Voltage, with VCM = VDD and GMIN = 1 to 10. FIGURE 2-8: Normalized Input Offset Voltage vs. Power Supply Voltage, with VCM = VDD and GMIN = 100. FIGURE 2-9: Normalized Input Offset Voltage vs. Output Voltage, with GMIN = 1 to 10. FIGURE 2-10: Normalized Input Offset Voltage vs. Output Voltage, with GMIN = 100. FIGURE 2-11: Input Common Mode Voltage Headroom vs. Ambient Temperature. FIGURE 2-12: Normalized Input Offset Voltage vs. Common Mode Voltage, with VDD = 1.8V and GMIN = 1 to 10. FIGURE 2-13: Normalized Input Offset Voltage vs. Common Mode Voltage, with VDD = 1.8V and GMIN = 100. FIGURE 2-14: Normalized Input Offset Voltage vs. Common Mode Voltage, with VDD = 5.5V and GMIN = 1 to 10. FIGURE 2-15: Normalized Input Offset Voltage vs. Common Mode Voltage, with VDD = 5.5V and GMIN = 100. FIGURE 2-16: Normalized CMRR and PSRR vs. Ambient Temperature. FIGURE 2-17: Normalized DC Open-Loop Gain vs. Ambient Temperature. FIGURE 2-18: The MCP6N11 Shows No Phase Reversal vs. Common Mode Voltage. FIGURE 2-19: Normalized Differential Mode Voltage Range vs. Ambient Temperature. FIGURE 2-20: Normalized Differential Input Error vs. Differential Voltage, with GMIN = 1. FIGURE 2-21: Normalized Differential Input Error vs. Differential Voltage, with GMIN = 2 to 100. FIGURE 2-22: The MCP6N11 Shows No Phase Reversal vs. Differential Voltage, with VDD = 5.5V. FIGURE 2-23: Input Bias and Offset Currents vs. Ambient Temperature, with VDD = +5.5V. FIGURE 2-24: Input Bias Current vs. Input Voltage (below VSS). FIGURE 2-25: Input Bias and Offset Currents vs. Common Mode Input Voltage, with TA = +85°C. FIGURE 2-26: Input Bias and Offset Currents vs. Common Mode Input Voltage, with TA = +125°C. FIGURE 2-27: Output Voltage Headroom vs. Output Current. FIGURE 2-28: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-29: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-30: Supply Current vs. Power Supply Voltage. FIGURE 2-31: Supply Current vs. Common Mode Input Voltage. 2.2 Frequency Response FIGURE 2-32: CMRR vs. Frequency. FIGURE 2-33: PSRR vs. Frequency. FIGURE 2-34: Normalized Open-Loop Gain vs. Frequency. FIGURE 2-35: Normalized Gain Bandwidth Product and Phase Margin vs. Ambient Temperature. FIGURE 2-36: Closed-Loop Output Impedance vs. Frequency. FIGURE 2-37: Gain Peaking vs. Normalized Capacitive Load. 2.3 Noise FIGURE 2-38: Normalized Input Noise Voltage Density vs. Frequency. FIGURE 2-39: Normalized Input Noise Voltage Density vs. Input Common Mode Voltage, with f = 100 Hz. FIGURE 2-40: Normalized Input Noise Voltage Density vs. Input Common Mode Voltage, with f = 10 kHz. FIGURE 2-41: Normalized Input Noise Voltage vs. Time, with GMIN = 1 to 10. FIGURE 2-42: Normalized Input Noise Voltage vs. Time, with GMIN = 100. 2.4 Time Response FIGURE 2-43: Small Signal Step Response. FIGURE 2-44: Large Signal Step Response. FIGURE 2-45: Slew Rate vs. Ambient Temperature. FIGURE 2-46: Maximum Output Voltage Swing vs. Frequency. FIGURE 2-47: Common Mode Input Overdrive Recovery Time vs. Normalized Gain. FIGURE 2-48: Differential Input Overdrive Recovery Time vs. Normalized Gain. FIGURE 2-49: Output Overdrive Recovery Time vs. Normalized Gain. FIGURE 2-50: The MCP6N11 Shows No Phase Reversal vs. Common Mode Input Overdrive, with VDD = 5.5V. FIGURE 2-51: The MCP6N11 Shows No Phase Reversal vs. Differential Input Overdrive, with VDD = 5.5V. 2.5 Enable/Calibration and POR Responses FIGURE 2-52: EN/CAL and Output Voltage vs. Time, with VDD = 1.8V. FIGURE 2-53: EN/CAL and Output Voltage vs. Time, with VDD = 5.5V FIGURE 2-54: EN/CAL Hysteresis vs. Ambient Temperature. FIGURE 2-55: EN/CAL Turn On Time vs. Ambient Temperature. FIGURE 2-56: Power Supply On and Off and Output Voltage vs. Time. FIGURE 2-57: POR Trip Voltages and Hysteresis vs. Temperature. FIGURE 2-58: Quiescent Current in Shutdown vs. Power Supply Voltage. FIGURE 2-59: Output Leakage Current vs. Output Voltage. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Signal Inputs 3.2 Analog Feedback Input 3.3 Analog Reference Input 3.4 Analog Output 3.5 Power Supply Pins 3.6 Digital Enable and VOS Calibration Input 3.7 Exposed Thermal Pad (EP) 4.0 Applications 4.1 Basic Performance FIGURE 4-1: Standard Circuit. FIGURE 4-2: MCP6N11 Block Diagram. FIGURE 4-3: DC Bias Resistors. 4.2 Functional Blocks FIGURE 4-4: Simplified Analog Input ESD Structures. FIGURE 4-5: Protecting the Analog Inputs Against High Voltages. FIGURE 4-6: Protecting the Analog Inputs Against High Currents. FIGURE 4-7: Input Voltage Ranges. 4.3 Applications Tips FIGURE 4-8: Output Resistor, RISO stabilizes large capacitive loads. FIGURE 4-9: Recommended RISO Values for Capacitive Loads. FIGURE 4-10: Simple Gain Circuit with Parasitic Capacitances. 4.4 Typical Applications FIGURE 4-11: Difference Amplifier. FIGURE 4-12: Difference Amplifier with Very Large Common Mode Component. FIGURE 4-13: High Side Current Detector. FIGURE 4-14: Wheatstone Bridge Amplifier. 5.0 Design Aids 5.1 Microchip Advanced Part Selector (MAPS) 5.2 Analog Demonstration Board 5.3 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Revision A (October 2011) Product Identification System Trademarks Worldwide Sales and Service
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