Datasheet MCP9902, MCP9903, MCP9904 (Microchip) - 5

MCP9902/3/4 1.3 Thermal Specifications Electrical Characteristics:
Unless otherwise specified, 3.0  VDD  3.6V at -40C  T  +125C A
Parameters Sym. Min. Typ. Max. Units Test Conditions
Thermal Resistance, 10L-VDFN, 3x3 JA — 78 — °C/W
Note 1:
JEDEC 2s2p, board size 76.2 x 114.3 x 1.6 mm, 1 via, airflow = 0 m/s. VDD VPOR VPORR VSS NPOR POR REARM VSS T
(2)
T
(3)
VLOW POR
Note 1:
When NPOR is low, the device is held in Reset.
2:
TPOR 1 s typical.
3:
TVLOW 2.7 s typical.
FIGURE 1-1:
POR and POR Rearm With Slow Rising VDD.  2015-2016 Microchip Technology Inc. DS20005382C-page 5 Document Outline Multi-Channel Low-Temperature Remote Diode Sensor Features Typical Applications Description Package Types MCP9902/3/4 Functional Block Diagram 1.0 Electrical Characteristics 1.1 Electrical Specifications Absolute Maximum Ratings 1.2 DC Characteristics 1.3 Thermal Specifications FIGURE 1-1: POR and POR Rearm With Slow Rising VDD. 1.4 SMBUS Module Specifications FIGURE 1-2: SMBus Timing Diagram. 2.0 Typical Operating Curves FIGURE 2-1: Supply Current vs. Conversion Rate (TA = +25°C, VDD = 3.3V). FIGURE 2-2: IDD vs. Temperature. FIGURE 2-3: Temperature Error vs. Filter Capacitor (VDD = 3.3V, TA = TD = +25°C, 2N3904). FIGURE 2-4: Temperature Error vs. Ambient Temperature (VDD = 3.3V, TD = +25°C, 16 Units, 2N3904). FIGURE 2-5: Temperature Error vs. Remote Temperature. (VDD = 3.3V, TD = +25°C, 16 Units, 2N3904). FIGURE 2-6: Temperature Error vs. Series Resistance (TA = +25°C, VDD = 3.3V). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Power Supply (VDD) 3.2 Diode 1 Pair (DN1/DP1) 3.3 Diode 2 Pair (DN2/DP2) 3.4 Anti-Parallel Diode Pair (DN3/DP2 and DN2/DP3) (MCP9904 only) 3.5 THERM LIMIT ALERT (THERM/ADDR) 3.6 Ground (GND) 3.7 Maskable ALERT (ALERT/THERM2) 3.8 SMBus Data (SMDATA) 3.9 SMBus Clock (SMCLK) 3.10 Exposed Thermal Pad (EP) 4.0 Functional Description FIGURE 4-1: MCP9902/3/4 System Diagram. 4.1 Power States 4.2 Conversion Rates TABLE 4-1: Conversion Rate 4.3 Dynamic Averaging 4.4 THERM Output 4.5 THERM Pin Address Decoding TABLE 4-2: I2C/SMBus Address Decode 4.6 ALERT/THERM2 Output 4.7 Temperature Measurement 4.8 Beta Compensation 4.9 Resistance Error Correction (REC) 4.10 Programmable External Diode Ideality Factor TABLE 4-3: Ideality Factor Look-Up Table (Diode Model) TABLE 4-4: Substrate Diode Ideality Factor Look-Up Table (BJT Model) 4.11 Diode Faults 4.12 Consecutive Alerts TABLE 4-5: Consecutive Alert/ THERM Settings 4.13 Limit Register Interaction 4.14 Digital Filter TABLE 4-6: Filter Settings FIGURE 4-2: Temperature Filter Step Response. FIGURE 4-3: Temperature Filter Impulse Response. 4.15 Temperature Measurement Results and Data TABLE 4-7: Temperature Data Format 5.0 Communications Protocol 5.1 SMBus Control Bits 5.2 SMBus Timeout 5.3 SMBus and I2C Compatibility 5.4 SMBus Protocols TABLE 5-1: Protocol Format TABLE 5-2: Write Byte Protocol TABLE 5-3: Read Byte Protocol TABLE 5-4: Send Byte Protocol TABLE 5-5: Receive Byte Protocol 5.5 Alert Response Address TABLE 5-6: Alert Response Address Protocol 5.6 Register Description TABLE 5-7: Register Set in Hexadecimal Order (Continued) 5.7 Data Read Interlock Register 5-1: iNT TEMP HI BYTE: Internal Diode High Byte Temperature Data Register (ADDRESS 00h) Register 5-2: INT temp LO byte: Internal Diode LOW Byte Temperature Data Register (ADDRESS 29h) Register 5-3: EXT(n) TEMP hi byte: EXTERNAL Diode High Byte Temperature Data Register (Addresses 01h, 23h, 2Ah) Register 5-4: EXT(n) TEMP Lo Byte: EXTERNAL Diode LOW Byte Temperature Data Register (Addresses 10h, 24h, 2Bh) Register 5-5: Status: status register reporting state of internal and external diodes (ADDRESS 02h) Register 5-6: CONFIG: Configuration Register (Addresses 03h and 09h) Register 5-7: CONVERT: TEMPERATURE CONVERSION RATE REGISTER (ADDRESS 04h, 0AH) Register 5-8: int diode hi limit temp: INTERNAL DIODE HIGH LIMIT TEMPERATURE REGISTER (Addresses 05h and 0Bh) Register 5-9: int diode lo lim TEMP – INTERNAL DIODE LOW LIMIT TEMPERATURE REGISTER (addresses 06H AND 0CH) Register 5-10: EXT(n) hi lim temp HB – EXTERNAL DIODE N HIGH TEMPERATURE LIMIT, high byte REGISTER (addresses 07h and 0dh, 15h, 2Ch) Register 5-11: EXT(n) hi lim LB – EXTERNAL DIODE N HIGH LIMIT TEMPERATURE, low byte REGISTER (Addresses 13H, 17h, 2eh) Register 5-12: EXT(n) lo lim HB – EXTERNAL DIODE N low LIMIT, high byte TEMPERATURE REGISTER (addresses 08h and 0eh, 16h, 2Dh) Register 5-13: EXT(N) LO lim LB – EXTERNAL DIODE N LOW LIMIT, low byte TEMPERATURE REGISTER (Addresses 14H, 18h, 2fh) Register 5-14: scrtchpd(N): sCRATCHPAD REGISTER (addresses 11H AND 12H) Register 5-15: ONE SHOT – ONE-shot temperature conversion initiation REGISTER (address 0fh) Register 5-16: EXT(n) THrm lim – external diode (N) therm limit REGISTER (addresses 19h, 1Ah and 30h) Register 5-17: iNTD THrm lim – internal diode therm limit REGISTER (address 20h) Register 5-18: THRM HYS – therm limit hysteresis REGISTER (address 21h) Register 5-19: EXT FLT STS – external diode fault status REGISTER (address 1Bh) Register 5-20: DIODE FAULT MASK – diode fault mask REGISTER (address 1Fh) Register 5-21: CONSEC ALERT – Consecutive Alert Register (address 22h) Register 5-22: ext(N) beta cfg – beta compensation configuration Register (addresses 25h and 26h) Register 5-23: ext (n) IDEALITY FACTOR – External Diode N Ideality Factor Register (addresses 27h, 28h and 31h) Register 5-24: HI LIM STS – High Limit Status Register (address 35h) Register 5-25: LO LIM STS – Low Limit Status Register (address 36h) Register 5-26: THRM LIM STS – High Limit Status Register (address 37h) Register 5-27: FLTR SEL: Filter Selection Register (address 40h) Register 5-28: PROD_ID – Product ID Register (address FDh) Register 5-29: MCHP_ID – Manufacturer ID Register (address FEh) Register 5-30: REVISION – Revision Register (address FFh) 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Revision C (July 2016) Revision B (March 2016) Revision A (December 2015) Product Identification System Trademarks Worldwide Sales and Service