Datasheet 6N137, HCNW137, HCNW2601, HCNW2611, HCPL-0600, HCPL-0601, HCPL-0611, HCPL-0630, HCPL-0631, HCPL-0661, HCPL-2601, HCPL-2611, HCPL-2630, HCPL-2631, HCPL-4661 (Broadcom) - 10
| Manufacturer | Broadcom |
| Description | High CMR, High Speed TTL Compatible Optocouplers 6N137, HCPL-26xx/06xx/4661, HCNW137/26x1 |
| Pages / Page | 29 / 10 — Insulation and Safety Related Specifications. 8-pin DIP. Widebod. … |
| File Format / Size | PDF / 1.3 Mb |
| Document Language | English |
Insulation and Safety Related Specifications. 8-pin DIP. Widebod. Parameter. Symbol. (300 Mil). SO-8 Value. (400 Mil). Unit. Conditions
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Text Version of Document
6N137, HCNW137, HCNW2601, HCNW2611, HCPL-0600, HCPL-0601, HCPL-0611, Insulation and Safety Related Specifications HCPL-0630, HCPL-0631, HCPL-0661, HCPL-2601, HCPL-2611, HCPL-2630, HCPL-2631, HCPL-4661 Data Sheet
Insulation and Safety Related Specifications 8-pin DIP Widebod Parameter Symbol (300 Mil) SO-8 Value (400 Mil) Unit Conditions Value Value
Minimum External Air Gap L(101) 7.1 4.9 9.6 mm Measured from input terminals to (External Clearance) output terminals, shortest distance through air. Minimum External Tracking L(102) 7.4 4.8 10.0 mm Measured from input terminals to (External Creepage) output terminals, shortest distance path along body. Minimum Internal Plastic Gap 0.08 0.08 1.0 mm Through insulation distance, (Internal Clearance) conductor to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Minimum Internal Tracking NA NA 4.0 mm Measured from input terminals to (Internal Creepage) output terminals, along internal cavity. Tracking Resistance CTI 200 200 200 V DIN IEC 112/VDE 0303 Part 1 (Comparative Tracking Index) Isolation Group IIIa IIIa IIIa Material Group (DIN VDE 0110, 1/89, Table 1) Option 300 – Surface mount classification is Class A in accordance with CECC 00802. Avago Technologies - 10 - Document Outline High CMR, High Speed TTL Compatible Optocouplers Description Functional Diagram Features Applications Selection Guide Ordering Information Schematic Package Outline Drawings 8-pin DIP Package (6N137, HCPL-2601/11/30/31, HCPL-4661) 8-pin DIP Package with Gull Wing Surface Mount Option 300 (6N137, HCPL-2601/11/30/31, HCPL-4661) Small-Outline SO-8 Package (HCPL-0600/01/11/30/31/61) 8-Pin Widebody DIP Package (HCNW137, HCNW2601/11) 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW137, HCNW2601/11) Reflow Soldering Profile Regulatory Information Insulation and Safety Related Specifications IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-06xx Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-26xx; 46xx; 6N13x Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCNW137/2601/2611 Only) Absolute Maximum Ratings (No Derating Required up to 85 °C) Recommended Operating Conditions Electrical Specifications Switching Specifications (AC) Package Characteristics Propagation Delay, Pulse-Width Distortion and Propagation Delay Skew
Insulation and Safety Related Specifications 8-pin DIP Widebod Parameter Symbol (300 Mil) SO-8 Value (400 Mil) Unit Conditions Value Value
Minimum External Air Gap L(101) 7.1 4.9 9.6 mm Measured from input terminals to (External Clearance) output terminals, shortest distance through air. Minimum External Tracking L(102) 7.4 4.8 10.0 mm Measured from input terminals to (External Creepage) output terminals, shortest distance path along body. Minimum Internal Plastic Gap 0.08 0.08 1.0 mm Through insulation distance, (Internal Clearance) conductor to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Minimum Internal Tracking NA NA 4.0 mm Measured from input terminals to (Internal Creepage) output terminals, along internal cavity. Tracking Resistance CTI 200 200 200 V DIN IEC 112/VDE 0303 Part 1 (Comparative Tracking Index) Isolation Group IIIa IIIa IIIa Material Group (DIN VDE 0110, 1/89, Table 1) Option 300 – Surface mount classification is Class A in accordance with CECC 00802. Avago Technologies - 10 - Document Outline High CMR, High Speed TTL Compatible Optocouplers Description Functional Diagram Features Applications Selection Guide Ordering Information Schematic Package Outline Drawings 8-pin DIP Package (6N137, HCPL-2601/11/30/31, HCPL-4661) 8-pin DIP Package with Gull Wing Surface Mount Option 300 (6N137, HCPL-2601/11/30/31, HCPL-4661) Small-Outline SO-8 Package (HCPL-0600/01/11/30/31/61) 8-Pin Widebody DIP Package (HCNW137, HCNW2601/11) 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW137, HCNW2601/11) Reflow Soldering Profile Regulatory Information Insulation and Safety Related Specifications IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-06xx Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCPL-26xx; 46xx; 6N13x Option 060 Only) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCNW137/2601/2611 Only) Absolute Maximum Ratings (No Derating Required up to 85 °C) Recommended Operating Conditions Electrical Specifications Switching Specifications (AC) Package Characteristics Propagation Delay, Pulse-Width Distortion and Propagation Delay Skew
