Datasheet LT319A (Analog Devices) - 10
| Manufacturer | Analog Devices |
| Description | Dual Comparator |
| Pages / Page | 12 / 10 — PACKAGE DESCRIPTION. Please refer to … |
| File Format / Size | PDF / 197 Kb |
| Document Language | English |
PACKAGE DESCRIPTION. Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings
Model Line for this Datasheet
Text Version of Document
LT119A/LT319A LM119/LM319
PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. H Package 10-Lead TO-5 Metal Can
(Reference LTC DWG # 05-08-1322) .335 – .370 (8.509 – 9.398) DIA .305 – .335 (7.747 – 8.509) .040 (1.016) .050 MAX (1.270) .165 – .185 MAX (4.191 – 4.699) REFERENCE SEATING PLANE PLANE GAUGE PLANE .500 – .750 .010 – .045* (12.700 – 19.050) (0.254 – 1.143) .016 – .021** (0.406 – 0.533) .027 – .045 36° (0.686 – 1.143) PIN 1 .028 – .034 (0.711 – 0.864) .230 ( 5.842) TYP .110 – .160 (2.794 – 4.064) INSULATING STANDOFF *LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE AND THE SEATING PLANE .016 – .024 **FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS (0.406 – 0.610) H10(TO-5) 0204
OBSOLETE PACKAGE
119a319afc 10 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Typical Applications Schematic Diagram Package Description Revision History Typical Application
PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. H Package 10-Lead TO-5 Metal Can
(Reference LTC DWG # 05-08-1322) .335 – .370 (8.509 – 9.398) DIA .305 – .335 (7.747 – 8.509) .040 (1.016) .050 MAX (1.270) .165 – .185 MAX (4.191 – 4.699) REFERENCE SEATING PLANE PLANE GAUGE PLANE .500 – .750 .010 – .045* (12.700 – 19.050) (0.254 – 1.143) .016 – .021** (0.406 – 0.533) .027 – .045 36° (0.686 – 1.143) PIN 1 .028 – .034 (0.711 – 0.864) .230 ( 5.842) TYP .110 – .160 (2.794 – 4.064) INSULATING STANDOFF *LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE AND THE SEATING PLANE .016 – .024 **FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS (0.406 – 0.610) H10(TO-5) 0204
OBSOLETE PACKAGE
119a319afc 10 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Typical Applications Schematic Diagram Package Description Revision History Typical Application
