Datasheet HMC494LP3, 494LP3E (Analog Devices) - 3
| Manufacturer | Analog Devices |
| Description | SMT 4 SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 18 GHz |
| Pages / Page | 6 / 3 — HMC494LP3 / 494LP3E. SMT GaAs HBT MMIC. DIVIDE-BY-8, DC - 18 GHz |
| File Format / Size | PDF / 373 Kb |
| Document Language | English |
HMC494LP3 / 494LP3E. SMT GaAs HBT MMIC. DIVIDE-BY-8, DC - 18 GHz
Model Line for this Datasheet
Text Version of Document
HMC494LP3 / 494LP3E
v05.1211
SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 18 GHz Output Voltage Waveform, Pin= 0 dBm, Fout= 882 MHz, T= 25 °C Absolute Maximum Ratings
4 500 rF input (vcc = +5v) +13 dBm supply voltage (vcc1, vcc2) +5.5v 4 300 channel temperature (tc) 135 °c t continuous Pdiss (t = 85 °c) (mV) 100 593 mW (derate 11.9 mW/° c above 85 °c) t M thermal resistance (r ) tH M s 84 °c/W -100 (junction to ground paddle) s AMPLITUDE storage temperature -65 to +150 °c s - -300 operating temperature -40 to +85 °c s - r esD sensitivity (HBM) class 1A -500 r o 22.7 23.1 23.5 23.9 24.3 24.7
Typical Supply Current vs. Vcc
o t TIME (nS) t c vcc1, vcc2 (v) icc (mA) c e 4.75 90 eLectrostAtic sensitive Device e t 5.0 103 t e oBserve HAnDLinG PrecAutions 5.25 115 e note: Divider will operate over full voltage range shown above s & D
Outline Drawing
s & D r r e e iD iD iv iv y D y D c c n n e e u notes: u q 1. LeADFrAMe MAteriAL: coPPer ALLoy q e 2. DiMensions Are in incHes [MiLLiMeters] e r 3. LeAD sPAcinG toLerAnce is non-cuMuLAtive 4. PAD Burr LenGtH sHALL Be 0.15mm MAXiMuM. r F PAD Burr HeiGHt sHALL Be 0.05mm MAXiMuM. F 5. PAcKAGe WArP sHALL not eXceeD 0.05mm. 6. ALL GrounD LeADs AnD GrounD PADDLe Must Be soLDereD to PcB rF GrounD. 7. reFer to Hittite APPLicAtion note For suGGesteD LAnD PAttern.
Package Information
Part number Package Body Material Lead Finish MsL rating Package Marking [3] HMc494LP3 Low stress injection Molded Plastic sn/Pb solder MsL1 [1] 494 XXXX HMc494LP3e roHs-compliant Low stress injection Molded Plastic 100% matte sn MsL1 [2] 494 XXXX [1] Max peak reflow temperature of 235 °c [2] Max peak reflow temperature of 260 °c [3] 4-Digit lot number XXXX Info F rmoatr p ion rfiurcne is , d hed ebly ivAe n r al y a og D n evd t ice o p s is bla eli c eve o ed t rd o b e e ras: H ccuratite tiatne M d reli iac bl reo . w Ho av wev e C er, n o o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rporation, 20 Alpha Road, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd ho e ne r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o tniltie n .c e ao t m
4 - 3
license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 o plica r a tio p n S p u s p @ po h rt itt : P ite ho . n c e o : 1m -800-ANALOG-D
v05.1211
SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 18 GHz Output Voltage Waveform, Pin= 0 dBm, Fout= 882 MHz, T= 25 °C Absolute Maximum Ratings
4 500 rF input (vcc = +5v) +13 dBm supply voltage (vcc1, vcc2) +5.5v 4 300 channel temperature (tc) 135 °c t continuous Pdiss (t = 85 °c) (mV) 100 593 mW (derate 11.9 mW/° c above 85 °c) t M thermal resistance (r ) tH M s 84 °c/W -100 (junction to ground paddle) s AMPLITUDE storage temperature -65 to +150 °c s - -300 operating temperature -40 to +85 °c s - r esD sensitivity (HBM) class 1A -500 r o 22.7 23.1 23.5 23.9 24.3 24.7
Typical Supply Current vs. Vcc
o t TIME (nS) t c vcc1, vcc2 (v) icc (mA) c e 4.75 90 eLectrostAtic sensitive Device e t 5.0 103 t e oBserve HAnDLinG PrecAutions 5.25 115 e note: Divider will operate over full voltage range shown above s & D
Outline Drawing
s & D r r e e iD iD iv iv y D y D c c n n e e u notes: u q 1. LeADFrAMe MAteriAL: coPPer ALLoy q e 2. DiMensions Are in incHes [MiLLiMeters] e r 3. LeAD sPAcinG toLerAnce is non-cuMuLAtive 4. PAD Burr LenGtH sHALL Be 0.15mm MAXiMuM. r F PAD Burr HeiGHt sHALL Be 0.05mm MAXiMuM. F 5. PAcKAGe WArP sHALL not eXceeD 0.05mm. 6. ALL GrounD LeADs AnD GrounD PADDLe Must Be soLDereD to PcB rF GrounD. 7. reFer to Hittite APPLicAtion note For suGGesteD LAnD PAttern.
Package Information
Part number Package Body Material Lead Finish MsL rating Package Marking [3] HMc494LP3 Low stress injection Molded Plastic sn/Pb solder MsL1 [1] 494 XXXX HMc494LP3e roHs-compliant Low stress injection Molded Plastic 100% matte sn MsL1 [2] 494 XXXX [1] Max peak reflow temperature of 235 °c [2] Max peak reflow temperature of 260 °c [3] 4-Digit lot number XXXX Info F rmoatr p ion rfiurcne is , d hed ebly ivAe n r al y a og D n evd t ice o p s is bla eli c eve o ed t rd o b e e ras: H ccuratite tiatne M d reli iac bl reo . w Ho av wev e C er, n o o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rporation, 20 Alpha Road, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd ho e ne r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o tniltie n .c e ao t m
4 - 3
license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 o plica r a tio p n S p u s p @ po h rt itt : P ite ho . n c e o : 1m -800-ANALOG-D
