Datasheet LTM4636 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | 40A DC/DC μModule Regulator |
| Pages / Page | 36 / 2 — absoluTe MaxiMuM raTings. (Note 1). pin conFiguraTion. Note:. orDer … |
| File Format / Size | PDF / 1.2 Mb |
| Document Language | English |
absoluTe MaxiMuM raTings. (Note 1). pin conFiguraTion. Note:. orDer inForMaTion http://www.linear.com/product/LTM4636#orderinfo
Model Line for this Datasheet
Text Version of Document
LTM4636
absoluTe MaxiMuM raTings (Note 1)
VIN, SW, HZBREG, RUNP ... –0.3V to 16V TEMP+, TEMP– .. –0.3V to 0.8V VOUT .. –0.3V to 3.5V INTVCC Peak Output Current (Note 6) ..20mA PGOOD, RUNC, TMON, PVCC, MODE/PLLIN, PHMODE, Internal Operating Temperature Range FREQ, TRACK/SS, TEST1, TEST2, V – + OUTS1 , VOUTS1 , (Note 2) .. –40°C to 125°C SNSP1, SNSP2, TEST3, TEST4 ...–0.3V to INTVCC (5V) Storage Temperature Range .. –55°C to 125°C VFB, COMPA, COMPB (Note 7) .. –0.3V to 2.7V Reflow (Peak Body) Temperature .. 250°C PVCC Additional Output Current ..0mA to 50mA Note: PWM, CLKOUT, and GMON are outputs only.
pin conFiguraTion
TOP VIEW V – OUTS1 V + OUTS1 COMPB 1 2 3 4 5 6 7 8 9 10 11 12 A VOUT B TRACK/SS C TEST2 RUNC TEST4 (FLOAT PIN) HIZREG PGOOD D VFBCOMPA GND SNSP1 E PHASMD SNSP2 RUNP INTVCC PVCC SGND F FREQ GND CLKOUT NC TEMP– G TEMP+ TEST3 TEST1 PWM TMON GMON H MODE/PLLIN GND J K GND VIN SW L M BGA PACKAGE 144-LEAD (16mm × 16mm × 7.07mm) TJMAX = 125°C, θJA = 7.5°C/W, θJCbottom = 3°C/W, θJCtop = 15°C/W, θJBA = 12°C/W θJA = DERIVED FROM 95mm × 76mm PCB WITH 6 LAYERS, WEIGHT = 3.95g θ VALUES DETERMINED PER JESD51-12
Note:
θJA = (θJCbottom + θJBA)||θJCtop; θJBA is Board to Ambient
orDer inForMaTion http://www.linear.com/product/LTM4636#orderinfo PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4636EY#PBF –40°C to 125°C SAC305 (RoHS) LTM4636 BGA LTM4636IY#PBF –40°C to 125°C • Device temperature grade is indicated by a label on the shipping • Recommended BGA PCB Assembly and Manufacturing Procedures: container. www.linear.com/BGA-assy • Pad or ball finish code is per IPC/JEDEC J-STD-609. • BGA Package and Tray Drawings: www.linear.com/packaging • Terminal Finish Part Marking: www.linear.com/leadfree • This product is moisture sensitive. For more information, go to: • This product is not recommended for second side reflow. For more www.linear.com/BGA-assy information, go to www.linear.com/BGA-assy 4636f 2 For more information www.linear.com/LTM4636 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Package Photo Typical Application Design Resources Related Parts
absoluTe MaxiMuM raTings (Note 1)
VIN, SW, HZBREG, RUNP ... –0.3V to 16V TEMP+, TEMP– .. –0.3V to 0.8V VOUT .. –0.3V to 3.5V INTVCC Peak Output Current (Note 6) ..20mA PGOOD, RUNC, TMON, PVCC, MODE/PLLIN, PHMODE, Internal Operating Temperature Range FREQ, TRACK/SS, TEST1, TEST2, V – + OUTS1 , VOUTS1 , (Note 2) .. –40°C to 125°C SNSP1, SNSP2, TEST3, TEST4 ...–0.3V to INTVCC (5V) Storage Temperature Range .. –55°C to 125°C VFB, COMPA, COMPB (Note 7) .. –0.3V to 2.7V Reflow (Peak Body) Temperature .. 250°C PVCC Additional Output Current ..0mA to 50mA Note: PWM, CLKOUT, and GMON are outputs only.
pin conFiguraTion
TOP VIEW V – OUTS1 V + OUTS1 COMPB 1 2 3 4 5 6 7 8 9 10 11 12 A VOUT B TRACK/SS C TEST2 RUNC TEST4 (FLOAT PIN) HIZREG PGOOD D VFBCOMPA GND SNSP1 E PHASMD SNSP2 RUNP INTVCC PVCC SGND F FREQ GND CLKOUT NC TEMP– G TEMP+ TEST3 TEST1 PWM TMON GMON H MODE/PLLIN GND J K GND VIN SW L M BGA PACKAGE 144-LEAD (16mm × 16mm × 7.07mm) TJMAX = 125°C, θJA = 7.5°C/W, θJCbottom = 3°C/W, θJCtop = 15°C/W, θJBA = 12°C/W θJA = DERIVED FROM 95mm × 76mm PCB WITH 6 LAYERS, WEIGHT = 3.95g θ VALUES DETERMINED PER JESD51-12
Note:
θJA = (θJCbottom + θJBA)||θJCtop; θJBA is Board to Ambient
orDer inForMaTion http://www.linear.com/product/LTM4636#orderinfo PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4636EY#PBF –40°C to 125°C SAC305 (RoHS) LTM4636 BGA LTM4636IY#PBF –40°C to 125°C • Device temperature grade is indicated by a label on the shipping • Recommended BGA PCB Assembly and Manufacturing Procedures: container. www.linear.com/BGA-assy • Pad or ball finish code is per IPC/JEDEC J-STD-609. • BGA Package and Tray Drawings: www.linear.com/packaging • Terminal Finish Part Marking: www.linear.com/leadfree • This product is moisture sensitive. For more information, go to: • This product is not recommended for second side reflow. For more www.linear.com/BGA-assy information, go to www.linear.com/BGA-assy 4636f 2 For more information www.linear.com/LTM4636 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Package Photo Typical Application Design Resources Related Parts
