Datasheet LTM8050 (Analog Devices) - 2

LTM8050
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Notes 1, 3)
V TOP VIEW IN, RUN/SS Voltage ...60V 1 2 3 4 5 6 7 FB, RT, SHARE Voltage ...5V VOUT GND V A OUT, AUX ...25V PGOOD, SYNC, BIAS ...25V B BANK 1 V C IN + BIAS ...72V Maximum Junction Temperature (Note 2) .. 125°C D Solder Temperature ... 245°C E Storage Temperature... 125°C F BANK 2 G RT H AUX SHARE J BIAS PGOOD K FB BANK 3 L VIN RUN/SS SYNC BGA PACKAGE 70-PIN (15mm × 9mm × 4.92mm) TJMAX = 125°C, θJA = 24.4°C/W, θJC(BOTTOM) = 11.5°C/W, θJC(TOP) = 42.7°C/W, θJB = 18.7°C/W θ VALUES DETERMINED PER JESD51-9, MAX OUTPUT POWER WEIGHT = 1.8 GRAMS
ORDER INFORMATION http://www.linear.com/product/LTM8050#orderinfo PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM8050EY#PBF SAC305 (RoHS) LTM8050Y e1 BGA 3 –40°C to 125°C LTM8050IY#PBF SAC305 (RoHS) LTM8050Y e1 BGA 3 –40°C to 125°C LTM8050IY SnPb (63/37) LTM8050Y e0 BGA 3 –40°C to 125°C LTM8050MPY#PBF SAC305 (RoHS) LTM8050Y e1 BGA 3 –55°C to 125°C LTM8050MPY SnPb (63/37) LTM8050Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 8050fc 2 For more information www.linear.com/LTM8050 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Package Photo Related Parts Design Resources