Datasheet LTM4600HV (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | 10A, 28VIN High Efficiency DC/DC µModule |
| Pages / Page | 26 / 2 — absoluTe MaxiMuM raTings. pin conFiguraTion. (Note 1). orDer inForMaTion. … |
| File Format / Size | PDF / 457 Kb |
| Document Language | English |
absoluTe MaxiMuM raTings. pin conFiguraTion. (Note 1). orDer inForMaTion. PART MARKING. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER
Model Line for this Datasheet
Text Version of Document
LTM4600HV
absoluTe MaxiMuM raTings pin conFiguraTion (Note 1)
FCB, EXTV TOP VIEW CC, PGOOD, RUN/SS, VOUT ... –0.3V to 6V V CC V IN IN, SVIN, fADJ .. –0.3V to 28V EXT V OSET f ADJ SV VOSET, COMP .. –0.3V to 2.7V COMP Operating Temperature Range (Note 2) VIN SGND E and I Grades ...–40°C to 85°C RUN/SS FCB MP Grade ... –55°C to 125°C PGOOD Junction Temperature ... 125°C PGND Storage Temperature Range .. –55°C to 125°C Peak Solder Reflow Body Temperature ... 245°C VOUT LGA PACKAGE 104-LEAD (15mm × 15mm × 2.82mm) TJMAX = 125°C, θJA = 15°C/W, θJC = 6°C/W, θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS, WEIGHT = 1.7g
orDer inForMaTion PART MARKING PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4600HVEV#PBF LTM4600HVEV –40°C to 85°C LTM4600HVIV#PBF Au (RoHS) LTM4600HVIV e4 LGA 3 –40°C to 85°C LTM4600HVMPV#PBF LTM4600HVMPV –55°C to 125°C • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures: www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: www.linear.com/leadfree • LGA and BGA Package and Tray Drawings: www.linear.com/packaging 4600hvfe 2 For more information www.linear.com/LTM4600HV Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts
absoluTe MaxiMuM raTings pin conFiguraTion (Note 1)
FCB, EXTV TOP VIEW CC, PGOOD, RUN/SS, VOUT ... –0.3V to 6V V CC V IN IN, SVIN, fADJ .. –0.3V to 28V EXT V OSET f ADJ SV VOSET, COMP .. –0.3V to 2.7V COMP Operating Temperature Range (Note 2) VIN SGND E and I Grades ...–40°C to 85°C RUN/SS FCB MP Grade ... –55°C to 125°C PGOOD Junction Temperature ... 125°C PGND Storage Temperature Range .. –55°C to 125°C Peak Solder Reflow Body Temperature ... 245°C VOUT LGA PACKAGE 104-LEAD (15mm × 15mm × 2.82mm) TJMAX = 125°C, θJA = 15°C/W, θJC = 6°C/W, θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS, WEIGHT = 1.7g
orDer inForMaTion PART MARKING PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4600HVEV#PBF LTM4600HVEV –40°C to 85°C LTM4600HVIV#PBF Au (RoHS) LTM4600HVIV e4 LGA 3 –40°C to 85°C LTM4600HVMPV#PBF LTM4600HVMPV –55°C to 125°C • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures: www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: www.linear.com/leadfree • LGA and BGA Package and Tray Drawings: www.linear.com/packaging 4600hvfe 2 For more information www.linear.com/LTM4600HV Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts
