Datasheet LTM4600 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | 10A High Efficiency DC/DC µModule |
| Pages / Page | 26 / 2 — absoluTe MaxiMuM raTings. pin conFiguraTion. (Note 1). orDer inForMaTion. … |
| File Format / Size | PDF / 433 Kb |
| Document Language | English |
absoluTe MaxiMuM raTings. pin conFiguraTion. (Note 1). orDer inForMaTion. PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER
Model Line for this Datasheet
Text Version of Document
LTM4600
absoluTe MaxiMuM raTings pin conFiguraTion (Note 1)
FCB, EXTV TOP VIEW CC, PGOOD, RUN/SS, VOUT ... –0.3V to 6V V V CC IN, SVIN, fADJ .. –0.3V to 20V IN EXT V OSET f ADJ SV VOSET, COMP .. –0.3V to 2.7V COMP Operating Temperature Range (Note 2)..–40°C to 85°C VIN SGND Junction Temperature ... 125°C RUN/SS Storage Temperature Range .. –55°C to 125°C FCB PGOOD Peak Solder Reflow Body Temperature ... 245°C PGND VOUT LGA PACKAGE 104-LEAD (15mm × 15mm × 2.82mm) TJMAX = 125°C, θJA = 15°C/W, θJC = 6°C/W, θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS WEIGHT = 1.7g
orDer inForMaTion PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4600EV#PBF LTM4600EV Au (RoHS) e4 LGA 3 –40°C to 85°C LTM4600IV#PBF LTM4600IV • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures: www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: www.linear.com/leadfree • LGA and BGA Package and Tray Drawings: www.linear.com/packaging 4600fd 2 For more information www.linear.com/LTM4600 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Operation Applications Information Typical Application Package Description Revision History Typical Application Related Parts
absoluTe MaxiMuM raTings pin conFiguraTion (Note 1)
FCB, EXTV TOP VIEW CC, PGOOD, RUN/SS, VOUT ... –0.3V to 6V V V CC IN, SVIN, fADJ .. –0.3V to 20V IN EXT V OSET f ADJ SV VOSET, COMP .. –0.3V to 2.7V COMP Operating Temperature Range (Note 2)..–40°C to 85°C VIN SGND Junction Temperature ... 125°C RUN/SS Storage Temperature Range .. –55°C to 125°C FCB PGOOD Peak Solder Reflow Body Temperature ... 245°C PGND VOUT LGA PACKAGE 104-LEAD (15mm × 15mm × 2.82mm) TJMAX = 125°C, θJA = 15°C/W, θJC = 6°C/W, θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS WEIGHT = 1.7g
orDer inForMaTion PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4600EV#PBF LTM4600EV Au (RoHS) e4 LGA 3 –40°C to 85°C LTM4600IV#PBF LTM4600IV • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures: www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: www.linear.com/leadfree • LGA and BGA Package and Tray Drawings: www.linear.com/packaging 4600fd 2 For more information www.linear.com/LTM4600 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Operation Applications Information Typical Application Package Description Revision History Typical Application Related Parts
