Datasheet LTC3855 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | Dual, Multiphase Synchronous DC/DC Controller with Differential Remote Sense |
| Pages / Page | 44 / 2 — (Note 1) |
| File Format / Size | PDF / 2.2 Mb |
| Document Language | English |
(Note 1)
Model Line for this Datasheet
Text Version of Document
LTC3855 absoluTe MaxiMuM raTings
(Note 1)
Input Supply Voltage (VIN) ...–0.3V to 40V DIFFP, DIFFN ..–0.3V to INTVCC Top Side Driver Voltages ITEMP1, ITEMP2 Voltages ..–0.3V to INTVCC BOOST1, BOOST2 ..–0.3V to 46V ITH1, ITH2, VFB1, VFB2 Voltages ..–0.3V to INTVCC Switch Voltage (SW1, SW2) ...–5V to 40V INTVCC Peak Output Current (Note 8) ..100mA INTVCC, RUN1, RUN2, PGOOD(s), EXTVCC, Operating Junction Temperature Range (Notes 2, 3) (BOOST1-SW1), (BOOST2-SW2) ...–0.3V to 6V LTC3855 ...–40°C to 125°C SENSE1+, SENSE2+, SENSE1–, Storage Temperature Range ...–65°C to 125°C SENSE2– Voltages ...–0.3V to 13V Lead Temperature (Soldering, 10 sec) MODE/PLLIN, ILIM1, ILIM2, TK/SS1, TK/SS2, FREQ, (FE Package) ... 300°C DIFFOUT, PHASMD Voltages ...–0.3V to INTVCC pin conFiguraTion TOP VIEW ITEMP2 1 38 FREQ TOP VIEW ITEMP1 2 37 MODE/PLLIN RUN1 3 36 PHASMD – + SENSE1+ 4 35 CLKOUT SENSE1 SENSE1 RUN1 ITEMP1 ITEMP2 FREQ MODE/PLLIN PHASMD CLKOUT SW1 SENSE1– 5 34 SW1 40 39 38 37 36 35 34 33 32 31 TK/SS1 6 33 TG1 TK/SS1 1 30 TG1 I 7 32 TH1 BOOST1 ITH1 2 29 BOOST1 V 8 31 FB1 PGND1 VFB1 3 28 PGND1 V 9 30 FB2 BG1 SGND 4 27 BG1 I 10 39 29 TH2 VIN V SGND FB2 5 41 26 VIN TK/SS2 11 28 INTV SGND CC ITH2 6 25 INTVCC SENSE2+ 12 27 EXTVCC TK/SS2 7 24 EXTVCC SENSE2– 13 26 BG2 SENSE2+ 8 23 BG2 DIFFP 14 25 PGND2 SENSE2– 9 22 PGND2 DIFFP 10 21 DIFFN 15 24 BOOST2 BOOST2 11 12 13 14 15 16 17 18 19 20 DIFFOUT 16 23 TG2 RUN2 17 22 SW2 NC DIFFN RUN2 I LIM1 I LIM2 SW2 TG2 I 18 21 LIM1 PGOOD2 DIFFOUT PGOOD1 PGOOD2 I 19 20 UJ PACKAGE LIM2 PGOOD1 40-LEAD (6mm s 6mm) PLASTIC QFN FE PACKAGE TJMAX = 125°C, θJA = 33°C/W 38-LEAD PLASTIC SSOP EXPOSED PAD (PIN 41) IS SGND, MUST BE SOLDERED TO PCB TJMAX = 125°C, θJA = 25°C/W EXPOSED PAD (PIN 39) IS SGND, MUST BE SOLDERED TO PCB 3855f Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order information Electrical Characteristics Typical Performance Characteristics Pin Functions Functional Block Diagram Operation Applications Information Typical Applications Package Description Related Parts
(Note 1)
Input Supply Voltage (VIN) ...–0.3V to 40V DIFFP, DIFFN ..–0.3V to INTVCC Top Side Driver Voltages ITEMP1, ITEMP2 Voltages ..–0.3V to INTVCC BOOST1, BOOST2 ..–0.3V to 46V ITH1, ITH2, VFB1, VFB2 Voltages ..–0.3V to INTVCC Switch Voltage (SW1, SW2) ...–5V to 40V INTVCC Peak Output Current (Note 8) ..100mA INTVCC, RUN1, RUN2, PGOOD(s), EXTVCC, Operating Junction Temperature Range (Notes 2, 3) (BOOST1-SW1), (BOOST2-SW2) ...–0.3V to 6V LTC3855 ...–40°C to 125°C SENSE1+, SENSE2+, SENSE1–, Storage Temperature Range ...–65°C to 125°C SENSE2– Voltages ...–0.3V to 13V Lead Temperature (Soldering, 10 sec) MODE/PLLIN, ILIM1, ILIM2, TK/SS1, TK/SS2, FREQ, (FE Package) ... 300°C DIFFOUT, PHASMD Voltages ...–0.3V to INTVCC pin conFiguraTion TOP VIEW ITEMP2 1 38 FREQ TOP VIEW ITEMP1 2 37 MODE/PLLIN RUN1 3 36 PHASMD – + SENSE1+ 4 35 CLKOUT SENSE1 SENSE1 RUN1 ITEMP1 ITEMP2 FREQ MODE/PLLIN PHASMD CLKOUT SW1 SENSE1– 5 34 SW1 40 39 38 37 36 35 34 33 32 31 TK/SS1 6 33 TG1 TK/SS1 1 30 TG1 I 7 32 TH1 BOOST1 ITH1 2 29 BOOST1 V 8 31 FB1 PGND1 VFB1 3 28 PGND1 V 9 30 FB2 BG1 SGND 4 27 BG1 I 10 39 29 TH2 VIN V SGND FB2 5 41 26 VIN TK/SS2 11 28 INTV SGND CC ITH2 6 25 INTVCC SENSE2+ 12 27 EXTVCC TK/SS2 7 24 EXTVCC SENSE2– 13 26 BG2 SENSE2+ 8 23 BG2 DIFFP 14 25 PGND2 SENSE2– 9 22 PGND2 DIFFP 10 21 DIFFN 15 24 BOOST2 BOOST2 11 12 13 14 15 16 17 18 19 20 DIFFOUT 16 23 TG2 RUN2 17 22 SW2 NC DIFFN RUN2 I LIM1 I LIM2 SW2 TG2 I 18 21 LIM1 PGOOD2 DIFFOUT PGOOD1 PGOOD2 I 19 20 UJ PACKAGE LIM2 PGOOD1 40-LEAD (6mm s 6mm) PLASTIC QFN FE PACKAGE TJMAX = 125°C, θJA = 33°C/W 38-LEAD PLASTIC SSOP EXPOSED PAD (PIN 41) IS SGND, MUST BE SOLDERED TO PCB TJMAX = 125°C, θJA = 25°C/W EXPOSED PAD (PIN 39) IS SGND, MUST BE SOLDERED TO PCB 3855f Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order information Electrical Characteristics Typical Performance Characteristics Pin Functions Functional Block Diagram Operation Applications Information Typical Applications Package Description Related Parts
