Datasheet LTM8074 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | 40VIN, 1.2A Silent Switcher µModule Regulator |
| Pages / Page | 22 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Notes 1, 2). ORDER … |
| Revision | A |
| File Format / Size | PDF / 2.9 Mb |
| Document Language | English |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Notes 1, 2). ORDER INFORMATION. PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE
Text Version of Document
LTM8074
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Notes 1, 2)
VIN, RUN, PG Voltage .. 42V V TOP VIEW OUT Voltage ... 19V FB, TR/SS Voltage ... 4V GND RUN VIN GND A SYNC Voltage .. 6V PG RT Maximum Internal Temperature .. 125°C B GND Storage Temperature .. –55°C to 125°C TR/SS C Peak Reflow Solder Body Temperature ... 260°C BANK 1 FB SYNC D V E OUT 1 2 3 4 5 BGA PACKAGE 25-LEAD (4mm × 4mm × 1.82mm) BGA PACKAGE TJMAX = 125°C, θJA = 48.9°C/W, θJCbottom = 17.2°C/W θJCtop = 33.4°C/W, θJB = 19.4°C/W, WEIGHT = 0.08g θ VALUES DETERMINED PER JEDEC51-9, 51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER TERMINAL FINISH DEVICE FINISH CODE TYPE RATING (NOTES 3, 4)
LTM8074EY#PBF SAC305 (RoHS) LTM8074IY#PBF 8074 Y BGA 3 –40°C to 125°C LTM8074IY SnPb (63/37) • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Manufacturing Procedures • LGA and BGA Package and Tray Drawings Rev. 0 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Package Photo Package Description Typical Application Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Notes 1, 2)
VIN, RUN, PG Voltage .. 42V V TOP VIEW OUT Voltage ... 19V FB, TR/SS Voltage ... 4V GND RUN VIN GND A SYNC Voltage .. 6V PG RT Maximum Internal Temperature .. 125°C B GND Storage Temperature .. –55°C to 125°C TR/SS C Peak Reflow Solder Body Temperature ... 260°C BANK 1 FB SYNC D V E OUT 1 2 3 4 5 BGA PACKAGE 25-LEAD (4mm × 4mm × 1.82mm) BGA PACKAGE TJMAX = 125°C, θJA = 48.9°C/W, θJCbottom = 17.2°C/W θJCtop = 33.4°C/W, θJB = 19.4°C/W, WEIGHT = 0.08g θ VALUES DETERMINED PER JEDEC51-9, 51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER TERMINAL FINISH DEVICE FINISH CODE TYPE RATING (NOTES 3, 4)
LTM8074EY#PBF SAC305 (RoHS) LTM8074IY#PBF 8074 Y BGA 3 –40°C to 125°C LTM8074IY SnPb (63/37) • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Manufacturing Procedures • LGA and BGA Package and Tray Drawings Rev. 0 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Package Photo Package Description Typical Application Related Parts
