Datasheet MBRS320T3G, SBRS8320T3G, MBRS330T3G, NRVBS330T3G, MBRS340T3G, SBRS8340T3G (ON Semiconductor)
| Manufacturer | ON Semiconductor |
| Description | Surface Mount Schottky Power Rectifier |
| Pages / Page | 4 / 1 — www.onsemi.com. SCHOTTKY BARRIER. RECTIFIERS. 3.0 AMPERES. 20, 30, 40 … |
| Revision | 14 |
| File Format / Size | PDF / 134 Kb |
| Document Language | English |
www.onsemi.com. SCHOTTKY BARRIER. RECTIFIERS. 3.0 AMPERES. 20, 30, 40 VOLTS. Features. SMC 2−LEAD. CASE 403AC. MARKING DIAGRAM
Model Line for this Datasheet
Text Version of Document
MBRS320T3G, SBRS8320T3G, MBRS330T3G, NRVBS330T3G, MBRS340T3G, SBRS8340T3G Surface Mount Schottky Power Rectifier
www.onsemi.com
These devices employ the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features
SCHOTTKY BARRIER
epitaxial construction with oxide passivation and metal overlay
RECTIFIERS
contact. Ideally suited for low voltage, high frequency rectification, or
3.0 AMPERES
as free wheeling and polarity protection diodes, in surface mount applications where compact size and weight are critical to the system.
20, 30, 40 VOLTS Features
• Small Compact Surface Mountable Package with J-Bend Leads • Rectangular Package for Automated Handling • Highly Stable Oxide Passivated Junction
SMC 2−LEAD
• Very Low Forward Voltage Drop
CASE 403AC
(0.5 V Max @ 3.0 A, TJ = 25°C) •
MARKING DIAGRAM
Excellent Ability to Withstand Reverse Avalanche Energy Transients • Guard-Ring for Stress Protection AYWW • Device Passes ISO 7637 Pulse #1 B3xG G • SBRS8 and NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; B3x = Device Code AEC−Q101 Qualified and PPAP Capable* x = 2, 3 or 4 • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS A = Assembly Location** Y = Year Compliant WW = Work Week G = Pb−Free Package
Mechanical Characteristics
• (Note: Microdot may be in either location) Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 **The Assembly Location code (A) is front side • Weight: 217 mg (Approximately) optional. In cases where the Assembly Location is stamped in the package, the front side assembly code • Finish: All External Surfaces Corrosion Resistant and Terminal may be blank. Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes:
ORDERING INFORMATION
260°C Max. for 10 Seconds
Device Package Shipping
† • Polarity: Polarity Band on Plastic Body Indicates Cathode Lead MBRS320T3G SMC 2,500 / • Device Meets MSL 1 Requirements (Pb−Free) Tape & Reel • ESD Ratings: MBRS330T3G SMC 2,500 / (Pb−Free) Tape & Reel ♦ Machine Model = C (> 400 V) ♦ Human Body Model = 3B (> 8000 V) MBRS340T3G SMC 2,500 / (Pb−Free) Tape & Reel NRVBS330T3G SMC 2,500 / (Pb−Free) Tape & Reel SBRS8320T3G* SMC 2,500 / (Pb−Free) Tape & Reel SBRS8340T3G* SMC 2,500 / (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
August, 2017 − Rev. 14 MBRS340T3/D
www.onsemi.com
These devices employ the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features
SCHOTTKY BARRIER
epitaxial construction with oxide passivation and metal overlay
RECTIFIERS
contact. Ideally suited for low voltage, high frequency rectification, or
3.0 AMPERES
as free wheeling and polarity protection diodes, in surface mount applications where compact size and weight are critical to the system.
20, 30, 40 VOLTS Features
• Small Compact Surface Mountable Package with J-Bend Leads • Rectangular Package for Automated Handling • Highly Stable Oxide Passivated Junction
SMC 2−LEAD
• Very Low Forward Voltage Drop
CASE 403AC
(0.5 V Max @ 3.0 A, TJ = 25°C) •
MARKING DIAGRAM
Excellent Ability to Withstand Reverse Avalanche Energy Transients • Guard-Ring for Stress Protection AYWW • Device Passes ISO 7637 Pulse #1 B3xG G • SBRS8 and NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; B3x = Device Code AEC−Q101 Qualified and PPAP Capable* x = 2, 3 or 4 • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS A = Assembly Location** Y = Year Compliant WW = Work Week G = Pb−Free Package
Mechanical Characteristics
• (Note: Microdot may be in either location) Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 **The Assembly Location code (A) is front side • Weight: 217 mg (Approximately) optional. In cases where the Assembly Location is stamped in the package, the front side assembly code • Finish: All External Surfaces Corrosion Resistant and Terminal may be blank. Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes:
ORDERING INFORMATION
260°C Max. for 10 Seconds
Device Package Shipping
† • Polarity: Polarity Band on Plastic Body Indicates Cathode Lead MBRS320T3G SMC 2,500 / • Device Meets MSL 1 Requirements (Pb−Free) Tape & Reel • ESD Ratings: MBRS330T3G SMC 2,500 / (Pb−Free) Tape & Reel ♦ Machine Model = C (> 400 V) ♦ Human Body Model = 3B (> 8000 V) MBRS340T3G SMC 2,500 / (Pb−Free) Tape & Reel NRVBS330T3G SMC 2,500 / (Pb−Free) Tape & Reel SBRS8320T3G* SMC 2,500 / (Pb−Free) Tape & Reel SBRS8340T3G* SMC 2,500 / (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
August, 2017 − Rev. 14 MBRS340T3/D
