Datasheet HMC311SC70, 311SC70E (Analog Devices) - 6

HMC311SC70 / 311SC70E
v05.0517
InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 8 GHz Evaluation PCB
T M S - S R IE LIF P M K A C LO IN B A R & G E IV R D
List of Materials for Evaluation PCB 118040 [1]
The circuit board used in the final application should Item Description use RF circuit design techniques. Signal lines J1 - J2 PCB Mount SMA Connector should have 50 Ohm impedance while the package J3 - J4 DC Pin ground leads should be connected directly to the C1 - C3 100 pF Capacitor, 0402 Pkg. ground plane similar to that shown. A sufficient C4 1000 pF Capacitor, 0603 Pkg. number of via holes should be used to connect C5 2.2 µF Capacitor, Tantalum the top and bottom ground planes. The evaluation R1 22 Ohm Resistor, 1210 Pkg. board should be mounted to an appropriate heat L1 22 nH Inductor, 0603 Pkg. sink. The evaluation circuit board shown is available U1 HMC311SC70 / HMC311SC70E from Analog Devices upon request. PCB [2] 117360 Evaluation PCB [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350 For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
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Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Typical Performance Characteristics Broadband Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Reverse Isolation vs. Temperature Noise Figure vs. Temperature P1dB vs. Temperature Psat vs. Temperature Power Compression @ 1 GHz Power Compression @ 6 GHz Output IP3 vs. Temperature Gain, Power, IP3 & Supply Current vs. Supply Voltage @ 1 GHz Absolute Maximum Ratings Outline Drawing Package Information Pin Descriptions Application Circuit Recommended Component Values Evaluation PCB List of Materials for Evaluation PCB