Datasheet BC3602 (Holtek) - 3
| Manufacturer | Holtek |
| Description | Sub-1GHz Low RX Current FSK/GFSK RF Transceiver |
| Pages / Page | 61 / 3 — BC3602. Pin Description. Pin No. Pin Name. Type. Description. Absolute … |
| File Format / Size | PDF / 1.3 Mb |
| Document Language | English |
BC3602. Pin Description. Pin No. Pin Name. Type. Description. Absolute Maximum Ratings
Model Line for this Datasheet
Text Version of Document
BC3602 Pin Description Pin No. Pin Name Type Description
1 V_SX PWR Synthesizer power supply 2 EXTLN AI Connected to an external inductor 3 EXTLP AI Connected to an external inductor 4 V_XO PWR Analog positive power supply 5 XO AO Crystal oscillator output 6 XI AI Crystal oscillator input 7 CLDO PWR LDO output, connected to a bypass capacitor 8 GIO1 DI/O Multi-function I/O 1 9 VSS PWR Ground 10 CSN DI SPI chip select input, low active 11 SCK DI SPI clock input 12 GIO2 DI/O Multi-function I/O 2 13 SDIO DI/O SPI data input/output 14 GIO3 DI/O Multi-function I/O 3 15 V_DIG PWR Digital positive power supply 16 CLDO PWR LDO output, connected to a bypass capacitor 17 GIO4 DI/O Multi-function I/O 4 18 NC — Not connected 19 NC — Not connected 20 V_LNA PWR LNA power supply 21 VSS PWR Ground 22 RFIN AI RF LNA input 23 RFOUT AO RF power amplifier output 24 VSSRF PWR RF ground EP GND PWR Ground Legend: DI: Digital Input; DI/O: Digital Input/Output; AI: Analog Input; AO: Analog Output; PWR: Power The backside plate of EP shall be well soldered to ground on PCB, otherwise it will downgrade RF per- formance.
Absolute Maximum Ratings
Supply Voltage ..VSS-0.3V to VSS +3.6V Operating Temperature .. -40°C to 85°C Voltage on I/O Ports ..VSS-0.3V to VDD+0.3V ESD HBM .. ±2kV Storage Temperature .. -50°C to 125°C The device is ESD sensitive. HBM (Human Body Mode) is based on MIL-STD-883. Note: These are stress ratings only. Stresses exceeding the range specified under “Absolute Maximum Ratings” may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. Rev. 1.00 3 July 29, 2019 Document Outline Features General Description Block Diagram Pin Assignment Pin Description Absolute Maximum Ratings D.C. Characteristics A.C. Characteristics Memory Mapping Control Register Access SFR Mapping and Bit Definition Common Area Control Register Bank 0 Control Registers Bank 1 Control Registers Bank 2 Control Registers Special Function Description Sub-1GHz RF Transceiver Serial Interface System Clock Frequency Synthesizer Modulator State Machine Calibration AGC & RSSI Packet Handler FIFO Operation Modes Receiving Packet Judgement Continuous RX Mode ARK Mode: Auto-Resend and Auto-Ack ATR Mode: Auto-Transmit-Receive Message Flowchart Examples Abbreviation Application Circuits Package Information SAW Type 24-pin QFN (3mm×3mm×0.55mm) Outline Dimensions
1 V_SX PWR Synthesizer power supply 2 EXTLN AI Connected to an external inductor 3 EXTLP AI Connected to an external inductor 4 V_XO PWR Analog positive power supply 5 XO AO Crystal oscillator output 6 XI AI Crystal oscillator input 7 CLDO PWR LDO output, connected to a bypass capacitor 8 GIO1 DI/O Multi-function I/O 1 9 VSS PWR Ground 10 CSN DI SPI chip select input, low active 11 SCK DI SPI clock input 12 GIO2 DI/O Multi-function I/O 2 13 SDIO DI/O SPI data input/output 14 GIO3 DI/O Multi-function I/O 3 15 V_DIG PWR Digital positive power supply 16 CLDO PWR LDO output, connected to a bypass capacitor 17 GIO4 DI/O Multi-function I/O 4 18 NC — Not connected 19 NC — Not connected 20 V_LNA PWR LNA power supply 21 VSS PWR Ground 22 RFIN AI RF LNA input 23 RFOUT AO RF power amplifier output 24 VSSRF PWR RF ground EP GND PWR Ground Legend: DI: Digital Input; DI/O: Digital Input/Output; AI: Analog Input; AO: Analog Output; PWR: Power The backside plate of EP shall be well soldered to ground on PCB, otherwise it will downgrade RF per- formance.
Absolute Maximum Ratings
Supply Voltage ..VSS-0.3V to VSS +3.6V Operating Temperature .. -40°C to 85°C Voltage on I/O Ports ..VSS-0.3V to VDD+0.3V ESD HBM .. ±2kV Storage Temperature .. -50°C to 125°C The device is ESD sensitive. HBM (Human Body Mode) is based on MIL-STD-883. Note: These are stress ratings only. Stresses exceeding the range specified under “Absolute Maximum Ratings” may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. Rev. 1.00 3 July 29, 2019 Document Outline Features General Description Block Diagram Pin Assignment Pin Description Absolute Maximum Ratings D.C. Characteristics A.C. Characteristics Memory Mapping Control Register Access SFR Mapping and Bit Definition Common Area Control Register Bank 0 Control Registers Bank 1 Control Registers Bank 2 Control Registers Special Function Description Sub-1GHz RF Transceiver Serial Interface System Clock Frequency Synthesizer Modulator State Machine Calibration AGC & RSSI Packet Handler FIFO Operation Modes Receiving Packet Judgement Continuous RX Mode ARK Mode: Auto-Resend and Auto-Ack ATR Mode: Auto-Transmit-Receive Message Flowchart Examples Abbreviation Application Circuits Package Information SAW Type 24-pin QFN (3mm×3mm×0.55mm) Outline Dimensions
