Datasheet BD70522GUL (Rohm) - 4
| Manufacturer | Rohm |
| Description | Ultra Low Iq Buck Converter For Low Power Applications |
| Pages / Page | 28 / 4 — BD70522GUL. Absolute Maximum Ratings (Ta=25°C). Caution 1:. Caution 2:. … |
| File Format / Size | PDF / 2.7 Mb |
| Document Language | English |
BD70522GUL. Absolute Maximum Ratings (Ta=25°C). Caution 1:. Caution 2:. Thermal Resistance. Recommended Operating Conditions
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BD70522GUL Absolute Maximum Ratings (Ta=25°C)
Parameter Symbol Rating Unit Supply Voltage VIN -0.3 to +6 V LX Voltage VLX -0.3 to VIN+0.3V V EN Voltage VEN -0.3 to VIN+0.3V V PG Voltage VPG -0.3 to VIN+0.3V V VSEL1, 2 Voltage VSEL -0.3 to VIN+0.3V V PG Sink Current IPG 10 mA Power Dissipation Pd 0.592 (Note 1) W Maximum Junction Temperature Tjmax 150 °C Storage Temperature Range Tstg - 55 to + 150 °C
Caution 1:
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings.
Caution 2:
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with power dissipation taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (Note 1) The derating is 4.74 mW/°C while the device is operating above Ta≧25°C (Mounted on 4-layer 50.0mm x 58.0mm x 1.6mm FR-4 board)
Thermal Resistance
Parameter Symbol Thermal Resistance (Typ) Unit VCSP50L1C Junction to Ambient θJA 168.8 °C/W Layer Number of Material Board Size Measurement Board 4 Layers FR-4 50.0mm x 58.0mm x 1.6mmt
Recommended Operating Conditions
Parameter Symbol Min Typ Max Unit Supply Voltage(Note 2) VIN 2.5 3.6 5.5 V Output Current IOUT - - 500 mA Inductance(Note 3) L - 2.2 - µH Output Capacitance(Note 4) COUT 10 22 100 µF Operating Temperature Topr -40 +25 +85 °C (Note 2) Initial startup voltage is over 2.6V (Max) (Note 3) The effective inductance should be kept in the specified range from 1.5µH to 3.5µH, including the variety of tolerance, temperature, current derating. (Note 4) The effective capacitance should be kept this specified range including variety of tolerance, temperature, bias voltage derating.
Electrical Characteristics
(Unless otherwise specified VIN=3.6V Ta=25°C)
Parameter Symbol Min Typ Max Unit Conditions
Circuit Current
Shutdown Current IST - 50 1000 nA No switching, VEN= VIN Operating Quiescent Current IQ - 180 1000 nA VSEL=VIN Include VSEL, EN pin current
Under Voltage Lockout
UVLO Detection Threshold VUVLO 2.30 2.40 2.50 V VIN falling UVLO Release Threshold VUVLORLS 2.40 2.50 2.60 V VIN rising
www.rohm.com
TSZ02201-0Q1Q0AJ00400-1-2
© 2017 ROHM Co., Ltd. All rights reserved. 4/24 TSZ22111 • 15 • 001
21.Aug.2017 Rev.002
Document Outline General Description Features Applications Key Specifications Package Typical Application Circuit Contents Pin Configuration Pin Descriptions Block Diagram Absolute Maximum Ratings Thermal Resistance Recommended Operating Conditions Electrical Characteristics Detailed Descriptions Typical Performance Curves Figure 7. Efficiency vs Output Current Figure 8. Efficiency vs Output Current Figure 9. Efficiency vs Output Current Figure 10. Efficiency vs Output Current Figure 11. Output Voltage vs Output Current Figure 12. Output Voltage vs Output Current Figure 13. Output Voltage vs Output Current Figure 14. Output Voltage vs Output Current Figure 15. Switching Frequency vs Output Current Figure 16. Switching Frequency vs Output Current Figure 17. Switching Frequency vs Output Current Figure 18. Switching Frequency vs Output Current Figure 19. Output Ripple Voltage vs Output Current Figure 20. Output Ripple Voltage vs Output Current Figure 21. Output Ripple Voltage vs Output Current Figure 22. Output Ripple Voltage vs Output Current Figure 23. Load Transient Response Figure 24. Load Transient Response Figure 25. Load Transient Response Figure 26. Load Transient Response Figure 27. Line Transient Response Figure 28. Line Transient Response Figure 29. Line Transient Response Figure 30. Line Transient Response Figure 31. Line Transient Response Figure 32. Line Transient Response Figure 33. Line Transient Response Figure 34. Line Transient Response Figure 35. Startup Figure 36. Startup Figure 37. Shutdown Figure 38. Shutdown Figure 39. Input Voltage Ramp Up/Down Figure 40. Input Voltage Ramp Up/Down Figure 41. Input Voltage Ramp Up/Down Figure 42. Input Voltage Ramp Up/Down Timing Chart Application Examples I/O Equivalence Circuits Operational Notes 1. Reverse Connection of Power Supply 2. Power Supply Lines 3. Ground Voltage 4. Ground Wiring Pattern 5. Recommended Operating Conditions 6. Inrush Current 7. Operation Under Strong Electromagnetic Field 8. Testing on Application Boards 9. Inter-pin Short and Mounting Errors 10. Unused Input Pins 11. Regarding the Input Pin of the IC 12. Ceramic Capacitor 13. Area of Safe Operation (ASO) 14. Thermal Shutdown Circuit(TSD) 15. Over Current Protection Circuit (OCP) 16. Disturbance Light Ordering Information Marking Diagram Physical Dimension and Packing Information Revision History
Parameter Symbol Rating Unit Supply Voltage VIN -0.3 to +6 V LX Voltage VLX -0.3 to VIN+0.3V V EN Voltage VEN -0.3 to VIN+0.3V V PG Voltage VPG -0.3 to VIN+0.3V V VSEL1, 2 Voltage VSEL -0.3 to VIN+0.3V V PG Sink Current IPG 10 mA Power Dissipation Pd 0.592 (Note 1) W Maximum Junction Temperature Tjmax 150 °C Storage Temperature Range Tstg - 55 to + 150 °C
Caution 1:
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings.
Caution 2:
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with power dissipation taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (Note 1) The derating is 4.74 mW/°C while the device is operating above Ta≧25°C (Mounted on 4-layer 50.0mm x 58.0mm x 1.6mm FR-4 board)
Thermal Resistance
Parameter Symbol Thermal Resistance (Typ) Unit VCSP50L1C Junction to Ambient θJA 168.8 °C/W Layer Number of Material Board Size Measurement Board 4 Layers FR-4 50.0mm x 58.0mm x 1.6mmt
Recommended Operating Conditions
Parameter Symbol Min Typ Max Unit Supply Voltage(Note 2) VIN 2.5 3.6 5.5 V Output Current IOUT - - 500 mA Inductance(Note 3) L - 2.2 - µH Output Capacitance(Note 4) COUT 10 22 100 µF Operating Temperature Topr -40 +25 +85 °C (Note 2) Initial startup voltage is over 2.6V (Max) (Note 3) The effective inductance should be kept in the specified range from 1.5µH to 3.5µH, including the variety of tolerance, temperature, current derating. (Note 4) The effective capacitance should be kept this specified range including variety of tolerance, temperature, bias voltage derating.
Electrical Characteristics
(Unless otherwise specified VIN=3.6V Ta=25°C)
Parameter Symbol Min Typ Max Unit Conditions
Circuit Current
Shutdown Current IST - 50 1000 nA No switching, VEN= VIN Operating Quiescent Current IQ - 180 1000 nA VSEL=VIN Include VSEL, EN pin current
Under Voltage Lockout
UVLO Detection Threshold VUVLO 2.30 2.40 2.50 V VIN falling UVLO Release Threshold VUVLORLS 2.40 2.50 2.60 V VIN rising
www.rohm.com
TSZ02201-0Q1Q0AJ00400-1-2
© 2017 ROHM Co., Ltd. All rights reserved. 4/24 TSZ22111 • 15 • 001
21.Aug.2017 Rev.002
Document Outline General Description Features Applications Key Specifications Package Typical Application Circuit Contents Pin Configuration Pin Descriptions Block Diagram Absolute Maximum Ratings Thermal Resistance Recommended Operating Conditions Electrical Characteristics Detailed Descriptions Typical Performance Curves Figure 7. Efficiency vs Output Current Figure 8. Efficiency vs Output Current Figure 9. Efficiency vs Output Current Figure 10. Efficiency vs Output Current Figure 11. Output Voltage vs Output Current Figure 12. Output Voltage vs Output Current Figure 13. Output Voltage vs Output Current Figure 14. Output Voltage vs Output Current Figure 15. Switching Frequency vs Output Current Figure 16. Switching Frequency vs Output Current Figure 17. Switching Frequency vs Output Current Figure 18. Switching Frequency vs Output Current Figure 19. Output Ripple Voltage vs Output Current Figure 20. Output Ripple Voltage vs Output Current Figure 21. Output Ripple Voltage vs Output Current Figure 22. Output Ripple Voltage vs Output Current Figure 23. Load Transient Response Figure 24. Load Transient Response Figure 25. Load Transient Response Figure 26. Load Transient Response Figure 27. Line Transient Response Figure 28. Line Transient Response Figure 29. Line Transient Response Figure 30. Line Transient Response Figure 31. Line Transient Response Figure 32. Line Transient Response Figure 33. Line Transient Response Figure 34. Line Transient Response Figure 35. Startup Figure 36. Startup Figure 37. Shutdown Figure 38. Shutdown Figure 39. Input Voltage Ramp Up/Down Figure 40. Input Voltage Ramp Up/Down Figure 41. Input Voltage Ramp Up/Down Figure 42. Input Voltage Ramp Up/Down Timing Chart Application Examples I/O Equivalence Circuits Operational Notes 1. Reverse Connection of Power Supply 2. Power Supply Lines 3. Ground Voltage 4. Ground Wiring Pattern 5. Recommended Operating Conditions 6. Inrush Current 7. Operation Under Strong Electromagnetic Field 8. Testing on Application Boards 9. Inter-pin Short and Mounting Errors 10. Unused Input Pins 11. Regarding the Input Pin of the IC 12. Ceramic Capacitor 13. Area of Safe Operation (ASO) 14. Thermal Shutdown Circuit(TSD) 15. Over Current Protection Circuit (OCP) 16. Disturbance Light Ordering Information Marking Diagram Physical Dimension and Packing Information Revision History
