Datasheet DA9122 (Dialog Semiconductor) - 10

ManufacturerDialog Semiconductor
DescriptionHigh-Performance Dual-Channel DC-DC Converter
Pages / Page59 / 10 — DA9122. High-Performance Dual-Channel DC-DC Converter. 3.5. Buck …
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DA9122. High-Performance Dual-Channel DC-DC Converter. 3.5. Buck Characteristics. Table 8: Buck Electrical Characteristics

DA9122 High-Performance Dual-Channel DC-DC Converter 3.5 Buck Characteristics Table 8: Buck Electrical Characteristics

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DA9122 High-Performance Dual-Channel DC-DC Converter 3.5 Buck Characteristics
Unless otherwise noted, the following is valid for TJ = -40 °C to +125 °C, VSYS = 2.5 V to 5.5 V
Table 8: Buck Electrical Characteristics Parameter Description Conditions Min Typ Max Unit External Electrical Conditions
VIN Input voltage VIN = VSYS 2.5 5.5 V Output capacitance, per COUT phase, including voltage and -40 % 2 x 10 +30 % μF temperature coefficient Output capacitor series ESRCOUT f > 100 kHz 2 mΩ resistance, per phase Inductor value, per phase, L including current and -50 % 0.1 +20 % μH temperature dependence DCRL Inductor DC resistance 30 50 mΩ
Electrical Performance
Output voltage, IOUT = 0 mA to IMAX VOUT programmable in 10 mV 0.3 1.57 V steps VIN = 2.5 V to 5.5 V Output voltage, IOUT = 0 mA to IMAX VOUT_LIM programmable in 10 mV 0.3 1.9 V steps VIN = 3.0 V to 5.5 V Current limit, programmable ILIM per phase CHx_ILIM = 1010 -20 % 8 +20 % A Note 1 Output voltage accuracy, VOUT_ACC including static line and load VOUT ≥ 1 V -1 1 % regulation Output voltage accuracy, VOUT_ACC including static line and load VOUT < 1 V -10 10 mV regulation Power good voltage VTHR_PG_RISE Referred to V threshold for rising OUT -80 -50 -20 mV Power good voltage VTHR_PG_DWN Referred to V threshold for falling OUT -160 -130 -100 mV VTHR_HV High VOUT voltage threshold Referred to VOUT 100 150 200 mV VIN = 3 V to 3.6 V VOUT_TR_LINE Line transient response IOUT = 0.5 * IMAX 15 mV dt = 10 μs Switching frequency, post- fSW 4 MHz trim
Datasheet Revision 2.0 18-Jul-2019
CFR0011-120-00 10 of 59 © 2019 Dialog Semiconductor Document Outline General Description Key Features Applications System Diagrams Contents 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital I/O Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Buck2 5.1.4 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 WLCSP Handling 6.4 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection
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