Datasheet GW1NRF (GOWIN Semiconductor) - 2

ManufacturerGOWIN Semiconductor
DescriptionSeries of Bluetooth FPGA Products
Pages / Page86 / 2 — Copyright©2019 Guangdong Gowin Semiconductor Corporation. All Rights …
File Format / SizePDF / 1.3 Mb
Document LanguageEnglish

Copyright©2019 Guangdong Gowin Semiconductor Corporation. All Rights Reserved. Disclaimer

Copyright©2019 Guangdong Gowin Semiconductor Corporation All Rights Reserved Disclaimer

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Copyright©2019 Guangdong Gowin Semiconductor Corporation. All Rights Reserved.
No part of this document may be reproduced or transmitted in any form or by any denotes, electronic, mechanical, photocopying, recording or otherwise, without the prior written consent of GOWINSEMI.
Disclaimer
GOWINSEMI®, LittleBee®, Arora, and the GOWINSEMI logos are trademarks of GOWINSEMI and are registered in China, the U.S. Patent and Trademark Office and other countries. All other words and logos identified as trademarks or service marks are the property of their respective holders, as described at www.gowinsemi.com.cn. GOWINSEMI assumes no liability and provides no warranty (either expressed or implied) and is not responsible for any damage incurred to your hardware, software, data, or property resulting from usage of the materials or intellectual property except as outlined in the GOWINSEMI Terms and Conditions of Sale. All information in this document should be treated as preliminary. GOWINSEMI may make changes to this document at any time without prior notice. Anyone relying on this documentation should contact GOWINSEMI for the current documentation and errata. Document Outline Disclaimer Revision History Contents List of Figures List of Tables 1 About This Guide 1.1 Purpose 1.2 Supported Products 1.3 Related Documents 1.4 Abbreviations and Terminology 1.5 Support and Feedback 2 General Description 2.1 Features 2.2 Product Resources 2.3 Package Information 3 Architecture 3.1 Architecture Overview 3.2 SoC System FPU Memories Security Peripherals 3.2.1 Bluetooth Module Bluetooth Controller Mode Bluetooth Companion Mode Bluetooth Application Mode 3.2.2 Timers 3.2.3 Power Management DC DC Switching Power Supply Supply Monitoring 3.2.4 RF Description 3.2.5 Operating Modes 3.2.6 Software Development 3.3 Configurable Function Unit 3.3.1 CLU Register 3.3.2 CRU 3.4 IOB 3.4.1 I/O Buffer 3.4.2 True LVDS Design 3.4.3 I/O Logic IODELAY I/O Register IEM De-serializer DES and Clock Domain Transfer Serializer SER 3.4.4 I/O Logic Modes Basic Mode SDR Mode Generic DDR Mode IDES4 OSER4 Mode IVideo Mode OVideo Mode IDES8 Mode OSER8 Mode IDES10 Mode OSER10 Mode 3.5 Block SRAM (B-SRAM) 3.5.1 Introduction 3.5.2 Configuration Mode 3.5.3 Mixed Data Bus Width Configuration 3.5.4 Byte-enable 3.5.5 Parity Bit 3.5.6 Synchronous operation 3.5.7 Power up Conditions 3.5.8 Operation Modes Single Port Mode Dual Port Mode Semi-Dual Port Mode Read Only 3.5.9 B-SRAM Operation Modes Read Mode Pipeline Mode Bypass Mode Write Mode 3.5.10 Clock Operations Independent Clock Mode Read/Write Clock Operation Single Port Clock Mode 3.6 User Flash 3.6.1 Introduction 3.6.2 User Flash Ports 3.6.3 User Flash Mode Truth Table User Modes 3.7 DSP 3.7.1 Introduction Macro PADD MULT ALU 3.7.2 DSP Operations 3.8 Clock 3.8.1 Global Clock 3.8.2 PLL 3.8.3 HCLK 3.8.4 DLL 3.9 Long Wire (LW) 3.10 Global Set/Reset (GSR) 3.11 Programming Configuration 3.11.1 SRAM Configuration 3.11.2 Flash Configuration 3.12 On Chip Oscillator 4 AC/DC Characteristics 4.1 Operating Conditions 4.2 ESD 4.3 DC Characteristics 4.3.1 Static Current 4.3.2 RF Parameters 4.3.3 I/O Characteristics 4.4 Switching Characteristics 4.4.1 Internal Switching Characteristics 4.4.2 External Switching Characteristics 4.5 User Flash Characteristics 4.5.1 DC Characteristics1 4.5.2 Timing Parameters1,5,6 4.5.3 Operation Timing Diagrams 4.6 Configuration Interface Timing Specification 4.6.1 JTAG Port Timing Specifications 4.6.2 AUTO BOOT Port Timing Specifications 4.6.3 SSPI Port Timing Specifications 4.6.4 MSPI Port Timing Specifications 4.6.5 DUAL BOOT 4.6.6 CPU 4.6.7 SERIAL 5 Ordering Information 5.1 Part Name 5.2 Package Mark
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