Datasheet AD8221-KGD (Analog Devices) - 8
| Manufacturer | Analog Devices |
| Description | Precision Instrumentation Amplifier |
| Pages / Page | 8 / 8 — AD8221-KGD. Known Good Die. OUTLINE DIMENSIONS. 1.575. 0.619. 0.615. … |
| File Format / Size | PDF / 176 Kb |
| Document Language | English |
AD8221-KGD. Known Good Die. OUTLINE DIMENSIONS. 1.575. 0.619. 0.615. 0.636. 0.3048. 0.446. 0.612. 0.379. 0.180 × 0.076. 0.826. 0.951. 0.570. 0.474
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AD8221-KGD Known Good Die OUTLINE DIMENSIONS 1.575 0.619 0.615 0.636 0.3048 0.446 0.612 0.379 0.180 × 0.076 1 2A 0.826 8 2B 0.951 0.570 0.474 3A 0.084 0.211 7 2.230 0.190 0.339 3B 0.622 6 0.823 4 0.076 × 0.076 5 (Pads 1, 2A-3A, 4-5 and 7-8) TOP VIEW SIDE VIEW (CIRCUIT SIDE) 0.490 0.635 A 0.621 0.649 2019- 1- 1 03-
Figure 3. 8-Pad Bare Die [CHIP] (C-8-14) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 4. Die Specifications Parameter Value Unit
Chip Size 1500 × 2155 µm Scribe Line Width 75 × 75 µm Die Size 1575 × 2230 µm Thickness 304.8 µm Backside None1 Not applicable Passivation OxyNitride Not applicable Bond Pads (Minimum) 76 × 76 µm Bond Pad Composition Titanium (Ti), tungsten (W) (99.5)/aluminum (Al), copper (Cu) (0.5) % 1 If connecting the backside to a voltage potential, tie the backside to −VS. Otherwise, leave the backside floating.
Table 5. Assembly Recommendations Assembly Component Recommendation
Die Attach No special requirements Bonding Method Gold ball or aluminum wedge Bonding Sequence Any
ORDERING GUIDE Model1 Temperature Range Package Description Package Option
AD8221-KGD-WP −40°C to +85°C 8-Pad Bare Die [CHIP], Waffle Pack C-8-14 1 The AD8221-KGD-WP is a RoHS compliant part.
©2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D20258-0-9/19(0)
Rev. 0 | Page 8 of 8 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION CONNECTION DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
AD8221-KGD Known Good Die OUTLINE DIMENSIONS 1.575 0.619 0.615 0.636 0.3048 0.446 0.612 0.379 0.180 × 0.076 1 2A 0.826 8 2B 0.951 0.570 0.474 3A 0.084 0.211 7 2.230 0.190 0.339 3B 0.622 6 0.823 4 0.076 × 0.076 5 (Pads 1, 2A-3A, 4-5 and 7-8) TOP VIEW SIDE VIEW (CIRCUIT SIDE) 0.490 0.635 A 0.621 0.649 2019- 1- 1 03-
Figure 3. 8-Pad Bare Die [CHIP] (C-8-14) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 4. Die Specifications Parameter Value Unit
Chip Size 1500 × 2155 µm Scribe Line Width 75 × 75 µm Die Size 1575 × 2230 µm Thickness 304.8 µm Backside None1 Not applicable Passivation OxyNitride Not applicable Bond Pads (Minimum) 76 × 76 µm Bond Pad Composition Titanium (Ti), tungsten (W) (99.5)/aluminum (Al), copper (Cu) (0.5) % 1 If connecting the backside to a voltage potential, tie the backside to −VS. Otherwise, leave the backside floating.
Table 5. Assembly Recommendations Assembly Component Recommendation
Die Attach No special requirements Bonding Method Gold ball or aluminum wedge Bonding Sequence Any
ORDERING GUIDE Model1 Temperature Range Package Description Package Option
AD8221-KGD-WP −40°C to +85°C 8-Pad Bare Die [CHIP], Waffle Pack C-8-14 1 The AD8221-KGD-WP is a RoHS compliant part.
©2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D20258-0-9/19(0)
Rev. 0 | Page 8 of 8 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION CONNECTION DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
