Datasheet VSC7511 (Microchip) - 324

ManufacturerMicrochip
Description4 Port Unmanaged Industrial Ethernet Switch
Pages / Page324 / 324 — Ordering Information. Table 250 •. Part Order Number Description
File Format / SizePDF / 4.7 Mb
Document LanguageEnglish

Ordering Information. Table 250 •. Part Order Number Description

Ordering Information Table 250 • Part Order Number Description

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Ordering Information
11 Ordering Information
The VSC7511XMY is a lead-free (Pb-free), 172-pin, dual-row plastic quad flat no-lead (QFN) package with an exposed pad, 13 mm × 13 mm body size, 0.5 mm pin pitch, and 0.9 mm maximum height. Lead-free products from Microsemi comply with the temperatures and profiles defined in the joint IPC and JEDEC standard IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard. The following table lists the ordering information for the VSC7511 device.
Table 250 • Ordering Information Part Order Number Description
VSC7511XMY Lead-free (Pb-free), 172-pin, dual-row plastic quad flat no-lead (QFN) package with an exposed pad, 13 mm × 13 mm body size, 0.5 mm pin pitch, and 0.9 mm maximum height. VMDS-10488 VSC7511 Datasheet Revision 4.2 309 Document Outline 1 Revision History 1.1 Revision 4.2 1.2 Revision 4.1 1.3 Revision 4.0 1.4 Revision 2.1 1.5 Revision 2.0 2 Product Overview 2.1 General Features 2.1.1 Layer 2 Switching 2.1.2 Layer 2 Multicast 2.1.3 Quality of Service 2.1.4 Security 2.1.5 Management 2.1.6 Product Parameters 2.2 Applications 2.3 Functional Overview 2.3.1 Frame Arrival 2.3.2 Basic and Advanced Frame Classification 2.3.3 Versatile Content Aware Processor (VCAP) 2.3.4 Policing 2.3.5 Layer-2 Forwarding 2.3.6 Shared Queue System and Egress Scheduler 2.3.7 Rewriter and Frame Departure 2.3.8 CPU Port Module 2.3.9 Synchronous Ethernet and Precision Time Protocol 2.3.10 CPU System and Interfaces 3 Functional Descriptions 3.1 Port Numbering and Mappings 3.1.1 Supported SerDes Interfaces 3.1.2 PCIe Mode 3.1.3 Logical Port Numbers 3.2 Port Modules 3.2.1 MAC 3.2.2 PCS 3.3 SERDES1G 3.3.1 SERDES1G Basic Configuration 3.3.2 SERDES1G Loopback Modes 3.3.3 Synchronous Ethernet 3.3.4 SERDES1G Deserializer Configuration 3.3.5 SERDES1G Serializer Configuration 3.3.6 SERDES1G Input Buffer Configuration 3.3.7 SERDES1G Output Buffer Configuration 3.3.8 SERDES1G Clock and Data Recovery (CDR) in 100BASE-FX 3.3.9 Energy Efficient Ethernet 3.3.10 SERDES1G Data Inversion 3.4 SERDES6G 3.4.1 SERDES6G Basic Configuration 3.4.2 SERDES6G Loopback Modes 3.4.3 Synchronous Ethernet 3.4.4 SERDES6G Deserializer Configuration 3.4.5 SERDES6G Serializer Configuration 3.4.6 SERDES6G Input Buffer Configuration 3.4.7 SERDES6G Output Buffer Configuration 3.4.8 SERDES6G Clock and Data Recovery (CDR) in 100BASE-FX 3.4.9 Energy Efficient Ethernet 3.4.10 SERDES6G Data Inversion 3.4.11 SERDES6G Signal Detection Enhancements 3.4.12 High-Speed I/O Configuration Bus 3.5 Copper Transceivers 3.5.1 Register Access 3.5.2 Cat5 Twisted Pair Media Interface 3.5.3 Wake-On-LAN and SecureOn 3.5.4 Ethernet Inline Powered Devices 3.5.5 IEEE 802.3af PoE Support 3.5.6 ActiPHY™ Power Management 3.5.7 Testing Features 3.5.8 VeriPHY™ Cable Diagnostics 3.6 Statistics 3.6.1 Port Statistics 3.6.2 Accessing and Clearing Counters 3.7 Basic Classifier 3.7.1 General Data Extraction Setup 3.7.2 Frame Acceptance Filtering 3.7.3 QoS, DP, and DSCP Classification 3.7.4 VLAN Classification 3.7.5 Link Aggregation Code Generation 3.7.6 CPU Forwarding Determination 3.8 VCAP 3.8.1 Port Configuration 3.8.2 VCAP IS1 3.8.3 VCAP IS2 3.8.4 VCAP ES0 3.8.5 Range Checkers 3.8.6 VCAP Configuration 3.8.7 Advanced VCAP Operations 3.9 Analyzer 3.9.1 MAC Table 3.9.2 VLAN Table 3.9.3 Forwarding Engine 3.9.4 Analyzer Monitoring 3.10 Policers 3.10.1 Policer Allocation 3.10.2 Policer Burst and Rate Configuration 3.11 Shared Queue System 3.11.1 Buffer Management 3.11.2 Frame Reference Management 3.11.3 Resource Depletion Condition 3.11.4 Configuration Example 3.11.5 Watermark Programming and Consumption Monitoring 3.11.6 Advanced Resource Management 3.11.7 Ingress Pause Request Generation 3.11.8 Tail Dropping 3.11.9 Test Utilities 3.11.10 Energy Efficient Ethernet 3.12 Scheduler and Shapers 3.12.1 Scheduler Element 3.12.2 Egress Shapers 3.12.3 Deficit Weighted Round Robin 3.12.4 Round Robin 3.12.5 Shaping and DWRR Scheduling Examples 3.13 Rewriter 3.13.1 VLAN Editing 3.13.2 DSCP Remarking 3.13.3 FCS Updating 3.13.4 PTP Time Stamping 3.13.5 Special Rewriter Operations 3.14 CPU Port Module 3.14.1 Frame Extraction 3.14.2 Frame Injection 3.14.3 Node Processor Interface (NPI) 3.14.4 Frame Generation Engine for Periodic Transmissions 3.15 VRAP Engine 3.15.1 VRAP Request Frame Format 3.15.2 VRAP Response Frame Format 3.15.3 VRAP Header Format 3.15.4 VRAP READ Command 3.15.5 VRAP WRITE Command 3.15.6 VRAP READ-MODIFY-WRITE Command 3.15.7 VRAP IDLE Command 3.15.8 VRAP PAUSE Command 3.16 Layer 1 Timing 3.17 Hardware Time Stamping 3.17.1 Time Stamp Classification 3.17.2 Time of Day Generation 3.17.3 Hardware Time Stamping Module 3.17.4 Configuring I/O Delays 3.18 Clocking and Reset 3.18.1 Pin Strapping 4 VCore-Ie System and CPU Interfaces 4.1 VCore-Ie Configurations 4.2 Clocking and Reset 4.2.1 Watchdog Timer 4.3 Shared Bus 4.3.1 VCore-Ie Shared Bus Arbitration 4.3.2 Chip Register Region 4.3.3 SI Flash Region 4.3.4 PCIe Region 4.3.5 Starting the VCore-Ie CPU 4.3.6 Accessing the VCore-Ie Shared Bus 4.3.7 Paged Access to VCore-Ie Shared Bus 4.3.8 Software Debug and Development 4.4 VCore-Ie CPU 4.5 Load on-chip memory with code-image. For more information, see External CPU Support 4.5.1 Register Access and Multimaster Systems 4.5.2 Serial Interface in Slave Mode 4.5.3 MIIM Interface in Slave Mode 4.5.4 Access to the VCore Shared Bus 4.5.5 Mailbox and Semaphores 4.6 PCIe Endpoint Controller 4.6.1 Accessing Endpoint Registers 4.6.2 Enabling the Endpoint 4.6.3 Base Address Registers Inbound Requests 4.6.4 Outbound Interrupts 4.6.5 Outbound Access 4.6.6 Power Management 4.6.7 Device Reset Using PCIe 4.7 Frame DMA 4.7.1 DMA Control Block Structures 4.7.2 Enabling and Disabling FDMA Channels 4.7.3 Channel Counters 4.7.4 FDMA Events and Interrupts 4.7.5 FDMA Extraction 4.7.6 FDMA Injection 4.7.7 Manual Mode 4.8 VCore-Ie System Peripherals 4.8.1 SI Boot Controller 4.8.2 SI Master Controller 4.8.3 Timers 4.8.4 UARTs 4.8.5 Two-Wire Serial Interface 4.8.6 MII Management Controller 4.8.7 GPIO Controller 4.8.8 Serial GPIO Controller 4.8.9 Fan Controller 4.8.10 Temperature Sensor 4.8.11 Memory Integrity Monitor 4.8.12 Interrupt Controller 5 Features 5.1 Switch Control 5.1.1 Switch Initialization 5.2 Port Module Control 5.2.1 Port Reset Procedure 5.2.2 Port Counters 5.3 Layer-2 Switch 5.3.1 Basic Switching 5.3.2 Standard VLAN Operation 5.3.3 Provider Bridges and Q-in-Q Operation 5.3.4 Private VLANs 5.3.5 Asymmetric VLANs 5.3.6 Spanning Tree Protocols 5.3.7 IEEE 802.1X: Network Access Control 5.3.8 Link Aggregation 5.3.9 Simple Network Management Protocol (SNMP) 5.3.10 Mirroring 5.4 IGMP and MLD Snooping 5.4.1 IGMP and MLD Snooping Configuration 5.4.2 IP Multicast Forwarding Configuration 5.5 Quality of Service (QoS) 5.5.1 Basic QoS Configuration 5.5.2 IPv4 and IPv6 DSCP Remarking 5.5.3 Voice over IP (VoIP) 5.6 VCAP Applications 5.6.1 Notation for Control Lists Entries 5.6.2 Ingress Control Lists 5.6.3 Access Control Lists 5.6.4 Source IP Filter (SIP Filter) 5.6.5 DHCP Application 5.6.6 ARP Filtering 5.6.7 Ping Policing 5.6.8 TCP SYN Policing 5.7 CPU Extraction and Injection 5.7.1 Forwarding to CPU 5.7.2 Frame Extraction 5.7.3 Frame Injection 5.7.4 Frame Extraction and Injection Using An External CPU 6 Registers 7 Electrical Specifications 7.1 DC Specifications 7.1.1 Internal Pull-Up or Pull-Down Resistors 7.1.2 Reference Clock Inputs 7.1.3 PLL Clock Outputs 7.1.4 SERDES1G 7.1.5 SERDES6G 7.1.6 GPIO, SI, JTAG, and Miscellaneous Signals 7.1.7 Thermal Diode 7.2 AC Specifications 7.2.1 REFCLK Reference Clock (1G and 6G Serdes) 7.2.2 PLL Clock Outputs 7.2.3 SERDES1G 7.2.4 SERDES6G 7.2.5 Reset Timing Specifications 7.2.6 MIIM Timing Specifications 7.2.7 SI Boot Timing Master Mode Specifications 7.2.8 SI Timing Master Mode Specifications 7.2.9 SI Timing Slave Mode Specifications 7.2.10 JTAG Interface Specifications 7.2.11 Serial I/O Timing Specifications 7.2.12 Recovered Clock Outputs Specifications 7.2.13 Two-Wire Serial Interface Specifications 7.2.14 IEEE1588 Time Tick Output Specifications 7.3 Current and Power Consumption 7.4 Operating Conditions 7.4.1 Power Supply Sequencing 7.5 Stress Ratings 8 Pin Descriptions 8.1 Pin Diagram 8.2 Pins by Function 9 Package Information 9.1 Package Drawing 9.2 Thermal Specifications 9.3 Moisture Sensitivity 10 Design Guidelines 10.1 Power Supplies 10.2 Power Supply Decoupling 10.2.1 Reference Clock 10.2.2 Single-Ended REFCLK Input 10.3 Interfaces 10.3.1 General Recommendations 10.3.2 SerDes Interfaces (SGMII, 2.5GQSGMII) 10.3.3 Serial Interface 10.3.4 PCI Express Interface 10.3.5 Two-Wire Serial Interface 10.3.6 DDR3 SDRAM Interface 10.3.7 Thermal Diode External Connection 11 Ordering Information
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