Datasheet SFH 484 (OSRAM) - 10
| Manufacturer | OSRAM |
| Description | GaAlAs Infrared Emitters (880 nm) |
| Pages / Page | 14 / 10 — Version 1.0. SFH 484. TTW Soldering. Wel enlöten (TTW) |
| File Format / Size | PDF / 258 Kb |
| Document Language | English |
Version 1.0. SFH 484. TTW Soldering. Wel enlöten (TTW)
Model Line for this Datasheet
Text Version of Document
Version 1.0 SFH 484 TTW Soldering Wel enlöten (TTW)
IEC-61760-1 TTW / IEC-61760-1 TTW OHLY0598 300 C 10 s Normalkurve standard curve T 250 235 C ... 260 C Grenzkurven 2. Welle limit curves 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 Zwangskühlung 2 K/s forced cooling 50 0 0 50 100 150 200 s 250 t 2010-11-29 10 Document Outline Features: Besondere Merkmale: Applications Anwendungen Notes Hinweise Ordering Information Bestellinformation Maximum Ratings Grenzwerte Characteristics Kennwerte Grouping Gruppierung Relative Spectral Emission Relative spektrale Emission Radiant Intensity Strahlstärke Forward Current Durchlassstrom Forward Current vs. Lead Length between the package bottom and the PCB Flussstrom gg. Beinchenlänge zwischen Gehäuseunterseite und PCB Radiation Characteristics Abstrahlcharakteristik Package Outline Maßzeichnung Recommended Solder Pad Empfohlenes Lötpaddesign Disclaimer Disclaimer Glossary Glossar
IEC-61760-1 TTW / IEC-61760-1 TTW OHLY0598 300 C 10 s Normalkurve standard curve T 250 235 C ... 260 C Grenzkurven 2. Welle limit curves 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 Zwangskühlung 2 K/s forced cooling 50 0 0 50 100 150 200 s 250 t 2010-11-29 10 Document Outline Features: Besondere Merkmale: Applications Anwendungen Notes Hinweise Ordering Information Bestellinformation Maximum Ratings Grenzwerte Characteristics Kennwerte Grouping Gruppierung Relative Spectral Emission Relative spektrale Emission Radiant Intensity Strahlstärke Forward Current Durchlassstrom Forward Current vs. Lead Length between the package bottom and the PCB Flussstrom gg. Beinchenlänge zwischen Gehäuseunterseite und PCB Radiation Characteristics Abstrahlcharakteristik Package Outline Maßzeichnung Recommended Solder Pad Empfohlenes Lötpaddesign Disclaimer Disclaimer Glossary Glossar
