Datasheet DA9130-A (Dialog Semiconductor) - 44
| Manufacturer | Dialog Semiconductor |
| Description | High-Performance, 10 A, Dual-Phase DC-DC Converter |
| Pages / Page | 44 / 44 — DA9130-A. High-Performance, 10 A, Dual-Phase DC-DC. Converter. Status … |
| File Format / Size | PDF / 1.0 Mb |
| Document Language | English |
DA9130-A. High-Performance, 10 A, Dual-Phase DC-DC. Converter. Status Definitions. Revision. Datasheet Status. Product Status
Model Line for this Datasheet
Text Version of Document
DA9130-A High-Performance, 10 A, Dual-Phase DC-DC Converter Status Definitions Revision Datasheet Status Product Status Definition
1.<n> Target Development This datasheet contains the design specifications for product development. Specifications may be changed in any manner without notice. 2.<n> Preliminary Qualification This datasheet contains the specifications and preliminary characterization data for products in pre-production. Specifications may be changed at any time without notice in order to improve the design. 3.<n> Final Production This datasheet contains the final specifications for products in volume production. The specifications may be changed at any time in order to improve the design, manufacturing and supply. Major specification changes are communicated via Customer Product Notifications. Datasheet changes are communicated via www.dialog-semiconductor.com. 4.<n> Obsolete Archived This datasheet contains the specifications for discontinued products. The information is provided for reference only.
Disclaimer
Unless otherwise agreed in writing, the Dialog Semiconductor products (and any associated software) referred to in this document are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of a Dialog Semiconductor product (or associated software) can reasonably be expected to result in personal injury, death or severe property or environmental damage. Dialog Semiconductor and its suppliers accept no liability for inclusion and/or use of Dialog Semiconductor products (and any associated software) in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Information in this document is believed to be accurate and reliable. However, Dialog Semiconductor does not give any representations or warranties, express or implied, as to the accuracy or completeness of such information. Dialog Semiconductor furthermore takes no responsibility whatsoever for the content in this document if provided by any information source outside of Dialog Semiconductor. Dialog Semiconductor reserves the right to change without notice the information published in this document, including, without limitation, the specification and the design of the related semiconductor products, software and applications. Notwithstanding the foregoing, for any automotive grade version of the device, Dialog Semiconductor reserves the right to change the information published in this document, including, without limitation, the specification and the design of the related semiconductor products, software and applications, in accordance with its standard automotive change notification process. Applications, software, and semiconductor products described in this document are for illustrative purposes only. Dialog Semiconductor makes no representation or warranty that such applications, software and semiconductor products will be suitable for the specified use without further testing or modification. Unless otherwise agreed in writing, such testing or modification is the sole responsibility of the customer and Dialog Semiconductor excludes all liability in this respect. Nothing in this document may be construed as a license for customer to use the Dialog Semiconductor products, software and applications referred to in this document. Such license must be separately sought by customer with Dialog Semiconductor. All use of Dialog Semiconductor products, software and applications referred to in this document is subject to Dialog Semiconductor’s Standard Terms and Conditions of Sale, available on the company website (www.dialog-semiconductor.com) unless otherwise stated. Dialog, Dialog Semiconductor and the Dialog logo are trademarks of Dialog Semiconductor Plc or its subsidiaries. All other product or service names and marks are the property of their respective owners. © 2020 Dialog Semiconductor. All rights reserved.
RoHS Compliance
Dialog Semiconductor’s suppliers certify that its products are in compliance with the requirements of Directive 2011/65/EU of the European Parliament on the restriction of the use of certain hazardous substances in electrical and electronic equipment. RoHS certificates from our suppliers are available on request.
Contacting Dialog Semiconductor
United Kingdom (Headquarters) North America Hong Kong China (Shenzhen) Dialog Semiconductor (UK) LTD Dialog Semiconductor Inc. Dialog Semiconductor Hong Kong Dialog Semiconductor China Phone: +44 1793 757700 Phone: +1 408 845 8500 Phone: +852 2607 4271 Phone: +86 755 2981 3669 Germany Japan Korea China (Shanghai) Dialog Semiconductor GmbH Dialog Semiconductor K. K. Dialog Semiconductor Korea Dialog Semiconductor China Phone: +49 7021 805-0 Phone: +81 3 5769 5100 Phone: +82 2 3469 8200 Phone: +86 21 5424 9058 The Netherlands Taiwan Dialog Semiconductor B.V. Dialog Semiconductor Taiwan Phone: +31 73 640 8822 Phone: +886 281 786 222 Email: Web site: enquiry@diasemi.com www.dialog-semiconductor.com
Datasheet Revision 1.0 31-Aug-2020
CFR0011-120-00 44 of 44 © 2020 Dialog Semiconductor
Document Outline General Description Key Features Benefits Applications System Diagrams Contents Table of Figures Table of Tables 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital IO Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Resistive Divider 4.1.7 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection
1.<n> Target Development This datasheet contains the design specifications for product development. Specifications may be changed in any manner without notice. 2.<n> Preliminary Qualification This datasheet contains the specifications and preliminary characterization data for products in pre-production. Specifications may be changed at any time without notice in order to improve the design. 3.<n> Final Production This datasheet contains the final specifications for products in volume production. The specifications may be changed at any time in order to improve the design, manufacturing and supply. Major specification changes are communicated via Customer Product Notifications. Datasheet changes are communicated via www.dialog-semiconductor.com. 4.<n> Obsolete Archived This datasheet contains the specifications for discontinued products. The information is provided for reference only.
Disclaimer
Unless otherwise agreed in writing, the Dialog Semiconductor products (and any associated software) referred to in this document are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of a Dialog Semiconductor product (or associated software) can reasonably be expected to result in personal injury, death or severe property or environmental damage. Dialog Semiconductor and its suppliers accept no liability for inclusion and/or use of Dialog Semiconductor products (and any associated software) in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Information in this document is believed to be accurate and reliable. However, Dialog Semiconductor does not give any representations or warranties, express or implied, as to the accuracy or completeness of such information. Dialog Semiconductor furthermore takes no responsibility whatsoever for the content in this document if provided by any information source outside of Dialog Semiconductor. Dialog Semiconductor reserves the right to change without notice the information published in this document, including, without limitation, the specification and the design of the related semiconductor products, software and applications. Notwithstanding the foregoing, for any automotive grade version of the device, Dialog Semiconductor reserves the right to change the information published in this document, including, without limitation, the specification and the design of the related semiconductor products, software and applications, in accordance with its standard automotive change notification process. Applications, software, and semiconductor products described in this document are for illustrative purposes only. Dialog Semiconductor makes no representation or warranty that such applications, software and semiconductor products will be suitable for the specified use without further testing or modification. Unless otherwise agreed in writing, such testing or modification is the sole responsibility of the customer and Dialog Semiconductor excludes all liability in this respect. Nothing in this document may be construed as a license for customer to use the Dialog Semiconductor products, software and applications referred to in this document. Such license must be separately sought by customer with Dialog Semiconductor. All use of Dialog Semiconductor products, software and applications referred to in this document is subject to Dialog Semiconductor’s Standard Terms and Conditions of Sale, available on the company website (www.dialog-semiconductor.com) unless otherwise stated. Dialog, Dialog Semiconductor and the Dialog logo are trademarks of Dialog Semiconductor Plc or its subsidiaries. All other product or service names and marks are the property of their respective owners. © 2020 Dialog Semiconductor. All rights reserved.
RoHS Compliance
Dialog Semiconductor’s suppliers certify that its products are in compliance with the requirements of Directive 2011/65/EU of the European Parliament on the restriction of the use of certain hazardous substances in electrical and electronic equipment. RoHS certificates from our suppliers are available on request.
Contacting Dialog Semiconductor
United Kingdom (Headquarters) North America Hong Kong China (Shenzhen) Dialog Semiconductor (UK) LTD Dialog Semiconductor Inc. Dialog Semiconductor Hong Kong Dialog Semiconductor China Phone: +44 1793 757700 Phone: +1 408 845 8500 Phone: +852 2607 4271 Phone: +86 755 2981 3669 Germany Japan Korea China (Shanghai) Dialog Semiconductor GmbH Dialog Semiconductor K. K. Dialog Semiconductor Korea Dialog Semiconductor China Phone: +49 7021 805-0 Phone: +81 3 5769 5100 Phone: +82 2 3469 8200 Phone: +86 21 5424 9058 The Netherlands Taiwan Dialog Semiconductor B.V. Dialog Semiconductor Taiwan Phone: +31 73 640 8822 Phone: +886 281 786 222 Email: Web site: enquiry@diasemi.com www.dialog-semiconductor.com
Datasheet Revision 1.0 31-Aug-2020
CFR0011-120-00 44 of 44 © 2020 Dialog Semiconductor
Document Outline General Description Key Features Benefits Applications System Diagrams Contents Table of Figures Table of Tables 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital IO Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Resistive Divider 4.1.7 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection
