Datasheet AD8044 (Analog Devices) - 5

ManufacturerAnalog Devices
DescriptionQuad 150 MHz Rail-to-Rail Amplifier
Pages / Page16 / 5 — AD8044. ABSOLUTE MAXIMUM RATINGS1. 2.5. TJ = +150 C. 2.0. 14-LEAD PLASTIC …
RevisionB
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AD8044. ABSOLUTE MAXIMUM RATINGS1. 2.5. TJ = +150 C. 2.0. 14-LEAD PLASTIC DIP PACKAGE. 1.5. 14-LEAD SOIC. 1.0

AD8044 ABSOLUTE MAXIMUM RATINGS1 2.5 TJ = +150 C 2.0 14-LEAD PLASTIC DIP PACKAGE 1.5 14-LEAD SOIC 1.0

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AD8044 ABSOLUTE MAXIMUM RATINGS1
While the AD8044 is internally short-circuit protected, this may Supply Voltage . +12.6 V not be sufficient to guarantee that the maximum junction tem- Internal Power Dissipation2 perature (+150∞C) is not exceeded under all conditions. To Plastic DIP Package (N) . 1.6 Watts ensure proper operation, it is necessary to observe the maximum Small Outline Package (R) . 1.0 Watts power derating curves. Input Voltage (Common-Mode) . ±VS ± 0.5 V Differential Input Voltage . ± 3.4 V
2.5
Output Short Circuit Duration
TJ = +150 C
. Observe Power Derating Curves Storage Temperature Range (N, R) . –65∞C to +125∞C
2.0 14-LEAD PLASTIC DIP PACKAGE
Lead Temperature Range (Soldering 10 sec) . +300∞C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the
1.5
device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
14-LEAD SOIC
2Specification is for the device in free air:
1.0
14-Lead Plastic Package: qJA = 75∞C/W
MAXIMUM POWER DISSIPATION (W)
14-Lead SOIC Package: qJA = 120∞C/W
MAXIMUM POWER DISSIPATION 0.5 –50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
The maximum power that can be safely dissipated by the
AMBIENT TEMPERATURE (

C)
AD8044 is limited by the associated rise in junction tempera- Figure 3. Maximum Power Dissipation vs. Temperature ture. The maximum safe junction temperature for plastic encap- sulated devices is determined by the glass transition temperature of the plastic, approximately +150∞C. Exceeding this limit temporarily may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of +175∞C for an extended period can result in device failure.
ORDERING GUIDE Temperature Package Package Model Range Description Option
AD8044AN –40∞C to +85∞C 14-Lead PDIP N-14 AD8044AR-14 –40∞C to +85∞C 14-Lead SOIC R-14 AD8044AR-14-REEL –40∞C to +85∞C 14-Lead SOIC 13" REEL R-14 AD8044AR-14-REEL7 –40∞C to +85∞C 14-Lead SOIC 7" REEL R-14 AD8044ARZ-14* –40∞C to +85∞C 14-Lead Plastic SOIC R-14 AD8044ARZ-14-REEL* –40∞C to +85∞C 14-Lead SOIC 13" REEL R-14 AD8044ARZ-14-REEL7* –40∞C to +85∞C 14-Lead SOIC 7" REEL R-14 *Z = Pb free part
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
WARNING!
accumulate on the human body and test equipment and can discharge without detection. Although the AD8016 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
ESD SENSITIVE DEVICE
precautions are recommended to avoid performance degradation or loss of functionality. REV. B –5– Document Outline FEATURES APPLICATIONS PRODUCT DESCRIPTION CONNECTION DIAGRAM SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION ORDERING GUIDE Typical Performance Characteristics Overdrive Recovery Circuit Description Driving Capacitance Loads APPLICATIONS RGB Buffer Active Filters Layout Considerations OUTLINE DIMENSIONS Revision History
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