Datasheet HMC601LP4, 601LP4E (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | 75 dB, FAST SETTLING, LOGARITHMIC DETECTOR / CONTROLLER 10 - 4000 MHz |
| Pages / Page | 8 / 5 — HMC601LP4 / 601LP4E. 75 dB, FAST SETTLING, LOGARITHMIC. DETECTOR / … |
| File Format / Size | PDF / 500 Kb |
| Document Language | English |
HMC601LP4 / 601LP4E. 75 dB, FAST SETTLING, LOGARITHMIC. DETECTOR / CONTROLLER 10 - 4000 MHz. LOGOUT Voltage
Model Line for this Datasheet
Text Version of Document
HMC601LP4 / 601LP4E
v01.0509
75 dB, FAST SETTLING, LOGARITHMIC DETECTOR / CONTROLLER 10 - 4000 MHz LOGOUT Voltage Input Return Loss vs. Frequency vs. Input Power & Frequency, TA = +25C
0 2.4 -5 50 MHz 900 MHz 1.9 1900 MHz -10 3500 MHz 4000 MHz -15 1.4 -20 LOGOUT (V) -25 +25 C 0.9 +85 C INPUT RETURN LOSS (dB) -30 -40 C 12 -35 0.4 0 1 2 3 4 5 -70 -60 -50 -40 -30 -20 -10 0 10 FREQUENCY (GHz) INPUT POWER (dBm)
Absolute Maximum Ratings
T Vcc1, Vcc2 0V to +5.5V ELECTROSTATIC SENSITIVE DEVICE PWD 0V to +5.5V OBSERVE HANDLING PRECAUTIONS VSET Input Voltage 0V to +5.5V LOGOUT Output Current 3 mA [1] Unless otherwise noted: Vcc1, Vcc2 = +3.3V, TA = +25C S - SM RF Input Power +12 dBm [2] This data is relative to the room temperature R performance of the HMC601LP4 Junction Temperature 125 °C O Continuous Pdiss (T = 85°C) T 0.32 Watts (Derate 7.95 mW/°C above 85°C) C Thermal Resistance (R ) th 126 °C/W E (junction to lead) T Storage Temperature -65 to +150 °C E Operating Temperature -40 to +85 °C ESD Sensitivity (HBM) Class 1C R D
Outline Drawing
E W O P NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN. Information furnis F heod r pri by An ce, de alog Devi lcievs eir s y b , a eliev nd to pla ed to be accu ce o rate anrder d relia sbl, pl e. H ease co owever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone: 978 rights of third parties that may result from its use. Specifications subject to change without notice. No Ph - o 25 ne 0 : 7 -3 81- 3 3 4 29 3 F -470 ax: 978 0 • Orde - r o 25 nlin 0- e a3 t 373
12 - 14
license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Order On-l Trademarks and registered trademarks are the property of their respective owners. ine at www.hit A ti p te.co plicati m on Support: Phone: 1-800-ANALOG-D
v01.0509
75 dB, FAST SETTLING, LOGARITHMIC DETECTOR / CONTROLLER 10 - 4000 MHz LOGOUT Voltage Input Return Loss vs. Frequency vs. Input Power & Frequency, TA = +25C
0 2.4 -5 50 MHz 900 MHz 1.9 1900 MHz -10 3500 MHz 4000 MHz -15 1.4 -20 LOGOUT (V) -25 +25 C 0.9 +85 C INPUT RETURN LOSS (dB) -30 -40 C 12 -35 0.4 0 1 2 3 4 5 -70 -60 -50 -40 -30 -20 -10 0 10 FREQUENCY (GHz) INPUT POWER (dBm)
Absolute Maximum Ratings
T Vcc1, Vcc2 0V to +5.5V ELECTROSTATIC SENSITIVE DEVICE PWD 0V to +5.5V OBSERVE HANDLING PRECAUTIONS VSET Input Voltage 0V to +5.5V LOGOUT Output Current 3 mA [1] Unless otherwise noted: Vcc1, Vcc2 = +3.3V, TA = +25C S - SM RF Input Power +12 dBm [2] This data is relative to the room temperature R performance of the HMC601LP4 Junction Temperature 125 °C O Continuous Pdiss (T = 85°C) T 0.32 Watts (Derate 7.95 mW/°C above 85°C) C Thermal Resistance (R ) th 126 °C/W E (junction to lead) T Storage Temperature -65 to +150 °C E Operating Temperature -40 to +85 °C ESD Sensitivity (HBM) Class 1C R D
Outline Drawing
E W O P NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN. Information furnis F heod r pri by An ce, de alog Devi lcievs eir s y b , a eliev nd to pla ed to be accu ce o rate anrder d relia sbl, pl e. H ease co owever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone: 978 rights of third parties that may result from its use. Specifications subject to change without notice. No Ph - o 25 ne 0 : 7 -3 81- 3 3 4 29 3 F -470 ax: 978 0 • Orde - r o 25 nlin 0- e a3 t 373
12 - 14
license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Order On-l Trademarks and registered trademarks are the property of their respective owners. ine at www.hit A ti p te.co plicati m on Support: Phone: 1-800-ANALOG-D
