Datasheet ADG408, ADG409 (Analog Devices) - 6
| Manufacturer | Analog Devices |
| Description | Datasheet LC2MOS 4-/8-Channel High Performance Analog Multiplexers |
| Pages / Page | 15 / 6 — ADG408/ADG409. Data Sheet. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter … |
| Revision | D |
| File Format / Size | PDF / 259 Kb |
| Document Language | English |
ADG408/ADG409. Data Sheet. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter Rating. ESD CAUTION
Model Line for this Datasheet
Text Version of Document
ADG408/ADG409 Data Sheet ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
Table 3.
stress rating only; functional operation of the product at these
Parameter Rating
or any other conditions above those indicated in the operational VDD to VSS 44 V section of this specification is not implied. Operation beyond VDD to GND −0.3 V to +32 V the maximum operating conditions for extended periods may VSS to GND +0.3 V to −32 V affect product reliability. Analog, Digital Inputs VSS − 2 V to VDD + 2 V or 20 mA, whichever occurs first Continuous Current, S or D 20 mA
ESD CAUTION
Peak Current, S or D (Pulsed at 1 ms, 10% Duty Cycle 40 mA Maximum) Operating Temperature Range Industrial (B Version) −40°C to +85°C Extended (T Version) −55°C to +125°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C CERDIP Package, Power Dissipation 900 mW θJA, Thermal Impedance 76°C/W Lead Temperature, Soldering 300°C (10 sec) PDIP Package, Power Dissipation 470 mW θJA, Thermal Impedance 117°C/W Lead Temperature, Soldering 260°C (10 sec) TSSOP Package, Power Dissipation 450 mW θJA, Thermal Impedance 155°C/W θJC, Thermal Impedance 50°C/W SOIC Package, Power Dissipation 600 mW θJA, Thermal Impedance 77°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C Rev. D | Page 6 of 15 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS DUAL SUPPLY SINGLE SUPPLY ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY OUTLINE DIMENSIONS ORDERING GUIDE
TA = 25°C, unless otherwise noted. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
Table 3.
stress rating only; functional operation of the product at these
Parameter Rating
or any other conditions above those indicated in the operational VDD to VSS 44 V section of this specification is not implied. Operation beyond VDD to GND −0.3 V to +32 V the maximum operating conditions for extended periods may VSS to GND +0.3 V to −32 V affect product reliability. Analog, Digital Inputs VSS − 2 V to VDD + 2 V or 20 mA, whichever occurs first Continuous Current, S or D 20 mA
ESD CAUTION
Peak Current, S or D (Pulsed at 1 ms, 10% Duty Cycle 40 mA Maximum) Operating Temperature Range Industrial (B Version) −40°C to +85°C Extended (T Version) −55°C to +125°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C CERDIP Package, Power Dissipation 900 mW θJA, Thermal Impedance 76°C/W Lead Temperature, Soldering 300°C (10 sec) PDIP Package, Power Dissipation 470 mW θJA, Thermal Impedance 117°C/W Lead Temperature, Soldering 260°C (10 sec) TSSOP Package, Power Dissipation 450 mW θJA, Thermal Impedance 155°C/W θJC, Thermal Impedance 50°C/W SOIC Package, Power Dissipation 600 mW θJA, Thermal Impedance 77°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C Rev. D | Page 6 of 15 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS DUAL SUPPLY SINGLE SUPPLY ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY OUTLINE DIMENSIONS ORDERING GUIDE
