Datasheet MBRM120LT1G, NRVBM120LT1G, MBRM120LT3G, NRVBM120LT3G (ON Semiconductor)
| Manufacturer | ON Semiconductor |
| Description | Schottky Power Rectifier, Surface Mount, 1.0 A, 20 V |
| Pages / Page | 6 / 1 — http://onsemi.com. SCHOTTKY BARRIER. RECTIFIER. 1.0 AMPERES, 20 VOLTS. … |
| Revision | 7 |
| File Format / Size | PDF / 266 Kb |
| Document Language | English |
http://onsemi.com. SCHOTTKY BARRIER. RECTIFIER. 1.0 AMPERES, 20 VOLTS. POWERMITE. CASE 457. PLASTIC. MARKING DIAGRAM. Features
Model Line for this Datasheet
MBRM120L
Text Version of Document
MBRM120LT1G, NRVBM120LT1G, MBRM120LT3G, NRVBM120LT3G Schottky Power Rectifier, Surface Mount, 1.0 A, 20 V
http://onsemi.com
The Schottky POWERMITE employs the Schottky Barrier
SCHOTTKY BARRIER
principle with a barrier metal and epitaxial construction that produces
RECTIFIER
optimal forward voltage drop−reverse current tradeoff. The advanced
1.0 AMPERES, 20 VOLTS
packaging techniques provide for a highly efficient micro miniature, space saving surface mount Rectifier. With its unique heatsink design, the POWERMITE has the same thermal performance as the SMA while being 50% smaller in footprint area, and delivering one of the lowest height profiles, 1.1 mm in the industry. Because of its small ANODE size, it is ideal for use in portable and battery powered products such as CATHODE cellular and cordless phones, chargers, notebook computers, printers, PDAs and PCMCIA cards. Typical applications are AC−DC and DC
POWERMITE CASE 457
−DC converters, reverse battery protection, and “ORing” of multiple
PLASTIC
supply voltages and any other application where performance and size are critical.
MARKING DIAGRAM Features
Low Profile − Maximum Height of 1.1 mm Small Footprint − Footprint Area of 8.45 mm2 M 1 BCFG 2 Low VF Provides Higher Efficiency and Extends Battery Life Supplied in 12 mm Tape and Reel Low Thermal Resistance with Direct Thermal Path of Die on M = Date Code Exposed Cathode Heat Sink BCF = Device Code ESD Ratings: G = Pb−Free Package Human Body Model = 3B (> 16 kV) Machine Model = C (> 400 V)
ORDERING INFORMATION
AEC−Q101 Qualified and PPAP Capable
Device Package Shipping
† NRVB Prefix for Automotive and Other Applications Requiring MBRM120LT1G POWERMITE 3,000 / Unique Site and Control Change Requirements (Pb−Free) Tape & Reel All Packages are Pb−Free* NRVBM120LT1G POWERMITE 3,000 / (Pb−Free) Tape & Reel
Mechanical Characteristics:
MBRM120LT3G POWERMITE 12,000 / POWERMITE is JEDEC Registered as D0−216AA (Pb−Free) Tape & Reel Case: Molded Epoxy NRVBM120LT3G POWERMITE 12,000 / Epoxy Meets UL 94 V−0 @ 0.125 in (Pb−Free) Tape & Reel Weight: 16.3 mg (Approximately) †For information on tape and reel specifications, Lead and Mounting Surface Temperature for Soldering Purposes: including part orientation and tape sizes, please 260 refer to our Tape and Reel Packaging Specifications C Maximum for 10 Seconds Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
January, 2012 − Rev. 7 MBRM120L/D
http://onsemi.com
The Schottky POWERMITE employs the Schottky Barrier
SCHOTTKY BARRIER
principle with a barrier metal and epitaxial construction that produces
RECTIFIER
optimal forward voltage drop−reverse current tradeoff. The advanced
1.0 AMPERES, 20 VOLTS
packaging techniques provide for a highly efficient micro miniature, space saving surface mount Rectifier. With its unique heatsink design, the POWERMITE has the same thermal performance as the SMA while being 50% smaller in footprint area, and delivering one of the lowest height profiles, 1.1 mm in the industry. Because of its small ANODE size, it is ideal for use in portable and battery powered products such as CATHODE cellular and cordless phones, chargers, notebook computers, printers, PDAs and PCMCIA cards. Typical applications are AC−DC and DC
POWERMITE CASE 457
−DC converters, reverse battery protection, and “ORing” of multiple
PLASTIC
supply voltages and any other application where performance and size are critical.
MARKING DIAGRAM Features
Low Profile − Maximum Height of 1.1 mm Small Footprint − Footprint Area of 8.45 mm2 M 1 BCFG 2 Low VF Provides Higher Efficiency and Extends Battery Life Supplied in 12 mm Tape and Reel Low Thermal Resistance with Direct Thermal Path of Die on M = Date Code Exposed Cathode Heat Sink BCF = Device Code ESD Ratings: G = Pb−Free Package Human Body Model = 3B (> 16 kV) Machine Model = C (> 400 V)
ORDERING INFORMATION
AEC−Q101 Qualified and PPAP Capable
Device Package Shipping
† NRVB Prefix for Automotive and Other Applications Requiring MBRM120LT1G POWERMITE 3,000 / Unique Site and Control Change Requirements (Pb−Free) Tape & Reel All Packages are Pb−Free* NRVBM120LT1G POWERMITE 3,000 / (Pb−Free) Tape & Reel
Mechanical Characteristics:
MBRM120LT3G POWERMITE 12,000 / POWERMITE is JEDEC Registered as D0−216AA (Pb−Free) Tape & Reel Case: Molded Epoxy NRVBM120LT3G POWERMITE 12,000 / Epoxy Meets UL 94 V−0 @ 0.125 in (Pb−Free) Tape & Reel Weight: 16.3 mg (Approximately) †For information on tape and reel specifications, Lead and Mounting Surface Temperature for Soldering Purposes: including part orientation and tape sizes, please 260 refer to our Tape and Reel Packaging Specifications C Maximum for 10 Seconds Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
January, 2012 − Rev. 7 MBRM120L/D
