Datasheet PMV65XP (Nexperia) - 10
| Manufacturer | Nexperia |
| Description | 20 V, single P-channel Trench MOSFET |
| Pages / Page | 14 / 10 — Nexperia. PMV65XP. 20 V, single P-channel Trench MOSFET. 12. Package … |
| Revision | 04201705 |
| File Format / Size | PDF / 742 Kb |
| Document Language | English |
Nexperia. PMV65XP. 20 V, single P-channel Trench MOSFET. 12. Package outline. Fig. 18. Package outline TO-236AB (SOT23)
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Nexperia PMV65XP 20 V, single P-channel Trench MOSFET 12. Package outline
3.0 1.1 2.8 0.9
3
0.45 0.15 2.5 1.4 2.1 1.2
1 2
0.48 0.15 0.38 0.09 1.9 Dimensions in mm 04-11-04
Fig. 18. Package outline TO-236AB (SOT23) 13. Soldering
3.3 2.9 1.9 solder lands solder resist 3 1.7 2 solder paste occupied area 0.7 0.6 (3×) (3×) Dimensions in mm 0.5 (3×) 0.6 (3×) 1 sot023_fr
Fig. 19. Reflow soldering footprint for TO-236AB (SOT23)
PMV65XP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 12 February 2013 10 / 14
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information
3.0 1.1 2.8 0.9
3
0.45 0.15 2.5 1.4 2.1 1.2
1 2
0.48 0.15 0.38 0.09 1.9 Dimensions in mm 04-11-04
Fig. 18. Package outline TO-236AB (SOT23) 13. Soldering
3.3 2.9 1.9 solder lands solder resist 3 1.7 2 solder paste occupied area 0.7 0.6 (3×) (3×) Dimensions in mm 0.5 (3×) 0.6 (3×) 1 sot023_fr
Fig. 19. Reflow soldering footprint for TO-236AB (SOT23)
PMV65XP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 12 February 2013 10 / 14
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information