Datasheet DFLS230 (Diodes) - 2

DFLS230 Maximum Ratings
(@TA = +25°C, unless otherwise specified.) Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage VRRM Working Peak Reverse Voltage VRWM 30 V DC Blocking Voltage V R RMS Reverse Voltage VR(RMS) 21 V Average Forward Current @ TT = +120°C IF(AV) 2.0 A Non-Repetitive Peak Forward Surge Current 8.3ms Single I Half Sine-Wave Superimposed on Rated Load FSM 40 A Power Dissipation (Note 5) P D 1.67 W Power Dissipation (Note 6) P D 556 mW Thermal Resistance Junction to Ambient (Note 5) RθJA 60 °C/W Thermal Resistance Junction to Ambient (Note 6) RθJA 180 °C/W Thermal Resistance Junction to Soldering (Note 7) RθJS 10 °C/W Operating Temperature Range TJ -55 to +125 °C Storage Temperature Range TSTG -55 to +125 °C
Electrical Characteristics
(@TA = +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 8) V(BR)R 30 — — V IR = 1.5mA — 0.36 0.42 IF = 1.0A Forward Voltage VF — V 0.4 0.49 IF = 2.0A Leakage Current (Note 8) IR — 0.15 1.0 mA VR = 30V, TA = +25°C Total Capacitance CT — 75 — pF VR = 10V, f = 1.0MHz Notes: 5. Part mounted on 50.8mm x 50.8mm GETEK board with 25.4mm x 25.4mm copper pad, 25% anode, 75% cathode. TA = +25°C. 6. Part mounted on FR-4 board with 1.8mm x 2.5mm cathode and 1.8mm x 1.2mm anode, 1oz. copper pads. TA = +25°C. 7. Theoretical RθJS calculated from the top center of the die straight down to the PCB cathode tab solder junction. 8. Short duration pulse test to minimize self-heating effect. DFLS230 2 of 5 August 2022 Document number: DS30518 Rev. 4 - 2
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