Datasheet MAX5048 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | 7.6A, 12ns, SOT23/TDFN MOSFET Driver |
| Pages / Page | 11 / 2 — MAX5048. 7.6A, 12ns, SOT23/TDFN, MOSFET Driver. ABSOLUTE MAXIMUM RATINGS. … |
| File Format / Size | PDF / 268 Kb |
| Document Language | English |
MAX5048. 7.6A, 12ns, SOT23/TDFN, MOSFET Driver. ABSOLUTE MAXIMUM RATINGS. Note 1:. PACKAGE THERMAL CHARACTERISTICS (Note 2)
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MAX5048 7.6A, 12ns, SOT23/TDFN, MOSFET Driver ABSOLUTE MAXIMUM RATINGS
Voltages Referenced to GND 6-Pin TDFN (derate 18.2mW/°C above +70°C) ...1454mW V+ ...-0.3V to +13V Operating Temperature Range ...-40°C to +125°C IN+, IN-...-0.3V to +14V Storage Temperature Range ...-65°C to +150°C N_OUT, P_OUT ..-0.3V to (V+ + 0.3V) Junction Temperature ..+150°C N_OUT Continuous Output Current (Note 1) ..390mA Lead Temperature (soldering, 10s) ...+300°C P_OUT Continuous Output Current (Note 1)...100mA Soldering Temperature (reflow) ...+260°C Continuous Power Dissipation* (TA = +70°C) 6-Pin SOT23 (derate 9.1mW/°C above +70°C)..727mW
Note 1:
Continuous output current is limited by the power dissipation of the package. *As per JEDEC51 standard. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
SOT23 Junction-to-Case Thermal Resistance (θJC)..75°C/W TDFN Junction-to-Case Thermal Resistance (θJC)...8.5°C/W
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
.
ELECTRICAL CHARACTERISTICS
(V+ = +12V, TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY
V+ Operating Range V+ 4.0 12.6 V V+ Undervoltage Lockout UVLO V+ rising 3.25 3.6 4.00 V V+ Undervoltage Lockout 400 mV Hysteresis V+ Undervoltage Lockout to V+ rising 300 ns Output Delay Time V+ Supply Current I+ IN+ = IN- = V+ 0.95 1.5 mA
n-CHANNEL OUTPUT
V TA = +25°C 0.23 0.32 V+ = +10V, Driver Output Resistance— IN-OUT = -100mA TA = +125°C 0.38 0.43 Pulling Down (MAX5048AAUT/ RON-N Ω V TA = +25°C 0.24 0.34 MAX5048BAUT) V+ = +4.5V, IN-OUT = -100mA TA = +125°C 0.40 0.47 TA = +25°C 0.31 0.34 VV+ = +10V, Driver Output Resistance— IN-OUT = -100mA TA = +125°C 0.46 0.51 Pulling Down (MAX5048AATT/ RON-N Ω V TA = +25°C 0.32 0.36 MAX5048BATT) V+ = +4.5V, IN-OUT = -100mA TA = +125°C 0.48 0.55 2 Maxim Integrated
MAX5048 7.6A, 12ns, SOT23/TDFN, MOSFET Driver ABSOLUTE MAXIMUM RATINGS
Voltages Referenced to GND 6-Pin TDFN (derate 18.2mW/°C above +70°C) ...1454mW V+ ...-0.3V to +13V Operating Temperature Range ...-40°C to +125°C IN+, IN-...-0.3V to +14V Storage Temperature Range ...-65°C to +150°C N_OUT, P_OUT ..-0.3V to (V+ + 0.3V) Junction Temperature ..+150°C N_OUT Continuous Output Current (Note 1) ..390mA Lead Temperature (soldering, 10s) ...+300°C P_OUT Continuous Output Current (Note 1)...100mA Soldering Temperature (reflow) ...+260°C Continuous Power Dissipation* (TA = +70°C) 6-Pin SOT23 (derate 9.1mW/°C above +70°C)..727mW
Note 1:
Continuous output current is limited by the power dissipation of the package. *As per JEDEC51 standard. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
SOT23 Junction-to-Case Thermal Resistance (θJC)..75°C/W TDFN Junction-to-Case Thermal Resistance (θJC)...8.5°C/W
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
.
ELECTRICAL CHARACTERISTICS
(V+ = +12V, TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY
V+ Operating Range V+ 4.0 12.6 V V+ Undervoltage Lockout UVLO V+ rising 3.25 3.6 4.00 V V+ Undervoltage Lockout 400 mV Hysteresis V+ Undervoltage Lockout to V+ rising 300 ns Output Delay Time V+ Supply Current I+ IN+ = IN- = V+ 0.95 1.5 mA
n-CHANNEL OUTPUT
V TA = +25°C 0.23 0.32 V+ = +10V, Driver Output Resistance— IN-OUT = -100mA TA = +125°C 0.38 0.43 Pulling Down (MAX5048AAUT/ RON-N Ω V TA = +25°C 0.24 0.34 MAX5048BAUT) V+ = +4.5V, IN-OUT = -100mA TA = +125°C 0.40 0.47 TA = +25°C 0.31 0.34 VV+ = +10V, Driver Output Resistance— IN-OUT = -100mA TA = +125°C 0.46 0.51 Pulling Down (MAX5048AATT/ RON-N Ω V TA = +25°C 0.32 0.36 MAX5048BATT) V+ = +4.5V, IN-OUT = -100mA TA = +125°C 0.48 0.55 2 Maxim Integrated