Datasheet LT8418 (Analog Devices) - 6
| Manufacturer | Analog Devices |
| Description | 100V Half-Bridge GaN Driver with Smart Integrated Bootstrap Switch in WLCSP-12 package |
| Pages / Page | 19 / 6 — Data Sheet. LT8418. Thermal Resistance. Table 3. 12-Ball WLCSP Package … |
| File Format / Size | PDF / 697 Kb |
| Document Language | English |
Data Sheet. LT8418. Thermal Resistance. Table 3. 12-Ball WLCSP Package Thermal Resistance. analog.com
Model Line for this Datasheet
Text Version of Document
Data Sheet LT8418 Thermal Resistance
Thermal performance is directly linked to PCB design and operating environment. Close attention to PCB thermal design is required.
Table 3. 12-Ball WLCSP Package Thermal Resistance Thermal Resistance
Junction-to-Ambient ΘJA 73 °C/W Junction-to-Case ΘJC (TOP) 0.6 °C/W Junction-to-Board ΘJB (BOTTOM) 12 °C/W
analog.com
Rev 0 6 of 19 Document Outline Features Applications General Description Typical Application TABLE OF CONTENTS Revision History Specifications Timing Diagrams Absolute Maximum Ratings Thermal Resistance Pin Configurations and Function Descriptions Pin Descriptions Block diagram Typical Performance Characteristics Theory of Operation 1.1. Chip Start-up, VCC UVLO/OVLO Protections 1.2. Input Interface INT, INB 1.3. Smart Bootstrap (BST) Switch and BST UVLO 1.4. Split Gate Driver Applications Information 1.1. Selecting the VCC and BST Capacitor 1.2. Selecting the Gate Resistance 1.3. Power Dissipation 1.4. PCB Bypass and Grounding Guideline 1.5. Soldering Guideline Outline Dimensions Typical Applications Ordering Guide Related Parts
Thermal performance is directly linked to PCB design and operating environment. Close attention to PCB thermal design is required.
Table 3. 12-Ball WLCSP Package Thermal Resistance Thermal Resistance
Junction-to-Ambient ΘJA 73 °C/W Junction-to-Case ΘJC (TOP) 0.6 °C/W Junction-to-Board ΘJB (BOTTOM) 12 °C/W
analog.com
Rev 0 6 of 19 Document Outline Features Applications General Description Typical Application TABLE OF CONTENTS Revision History Specifications Timing Diagrams Absolute Maximum Ratings Thermal Resistance Pin Configurations and Function Descriptions Pin Descriptions Block diagram Typical Performance Characteristics Theory of Operation 1.1. Chip Start-up, VCC UVLO/OVLO Protections 1.2. Input Interface INT, INB 1.3. Smart Bootstrap (BST) Switch and BST UVLO 1.4. Split Gate Driver Applications Information 1.1. Selecting the VCC and BST Capacitor 1.2. Selecting the Gate Resistance 1.3. Power Dissipation 1.4. PCB Bypass and Grounding Guideline 1.5. Soldering Guideline Outline Dimensions Typical Applications Ordering Guide Related Parts