Datasheet PMV30UN (Nexperia) - 9
| Manufacturer | Nexperia |
| Description | N-channel TrenchMOS ultra low level FET in SOT23 package |
| Pages / Page | 12 / 9 — Philips Semiconductors. PMV30UN. TrenchMOS™ ultra low level FET. Package … |
| File Format / Size | PDF / 244 Kb |
| Document Language | English |
Philips Semiconductors. PMV30UN. TrenchMOS™ ultra low level FET. Package outline. Plastic surface mounted package; 3 leads. SOT23
Model Line for this Datasheet
Text Version of Document
Philips Semiconductors PMV30UN
µ
TrenchMOS™ ultra low level FET 6. Package outline Plastic surface mounted package; 3 leads SOT23
D B E A X HE v M A
3
Q A A1
1 2
c e1 bp w M B Lp e detail X 0 1 2 mm scale
DIMENSIONS (mm are the original dimensions) A1 UNIT A b e v max. p c D E e1 HE Lp Q w
1.1 0.48 0.15 3.0 1.4 2.5 0.45 0.55 mm 0.1 1.9 0.95 0.2 0.1 0.9 0.38 0.09 2.8 1.2 2.1 0.15 0.45
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC EIAJ
97-02-28 SOT23 TO-236AB 99-09-13
Fig 14. SOT23.
9397 750 11569 © Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Product data Rev. 01 — 25 June 2003 9 of 12
Document Outline 1. Product profile 1.1 Description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Limiting values 4. Thermal characteristics 4.1 Transient thermal impedance 5. Characteristics 6. Package outline SOT23 7. Revision history 8. Data sheet status 9. Definitions 10. Disclaimers 11. Trademarks
µ
TrenchMOS™ ultra low level FET 6. Package outline Plastic surface mounted package; 3 leads SOT23
D B E A X HE v M A
3
Q A A1
1 2
c e1 bp w M B Lp e detail X 0 1 2 mm scale
DIMENSIONS (mm are the original dimensions) A1 UNIT A b e v max. p c D E e1 HE Lp Q w
1.1 0.48 0.15 3.0 1.4 2.5 0.45 0.55 mm 0.1 1.9 0.95 0.2 0.1 0.9 0.38 0.09 2.8 1.2 2.1 0.15 0.45
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC EIAJ
97-02-28 SOT23 TO-236AB 99-09-13
Fig 14. SOT23.
9397 750 11569 © Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Product data Rev. 01 — 25 June 2003 9 of 12
Document Outline 1. Product profile 1.1 Description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Limiting values 4. Thermal characteristics 4.1 Transient thermal impedance 5. Characteristics 6. Package outline SOT23 7. Revision history 8. Data sheet status 9. Definitions 10. Disclaimers 11. Trademarks