Datasheet ADA4870 (Analog Devices) - 7
| Manufacturer | Analog Devices |
| Description | High Speed, High Voltage, 1 A Output Drive Amplifier |
| Pages / Page | 24 / 7 — Data Sheet. ADA4870. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. VCC. … |
| File Format / Size | PDF / 668 Kb |
| Document Language | English |
Data Sheet. ADA4870. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. VCC. TFL. 19 VCC. SD 3. 18 VCC. 17 OUT. 16 OUT. TOP VIEW. INP 6
Model Line for this Datasheet
Text Version of Document
Data Sheet ADA4870 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS V 1 20 CC VCC TFL 2 19 VCC SD 3 18 VCC 4 ON 17 OUT ADA4870 NC 5 16 OUT TOP VIEW INP 6 15 (Not to Scale) OUT INN 7 14 OUT OUT 8 13 VEE NC 9 12 VEE V 10 11 EE VEE NOTES 1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN.
2
2. CONNECT THE EXPOSED PAD TO A SOLID EXTERNAL
-10
PLANE WITH LOW THERMAL RESISTANCE.
12125 Figure 3. Pin Configuration
Table 5. Pin Function Descriptions Pin No. Mnemonic Description
1 VCC Positive Power Supply Input. 2 TFL Thermal Monitor and Short-Circuit Flag (Referenced to VEE). 3 SD Shutdown (Active Low, Referenced to VEE). 4 ON Turn On/Enable (Active Low, Referenced to VEE). 5 NC No Connect. Do not connect to this pin. 6 INP Noninverting Input. 7 INN Inverting Input. 8 OUT Output Connection for Feedback Resistor. 9 NC No Connect. Do not connect to this pin. 10 to 13 VEE Negative Power Supply Input. 14 to 17 OUT Output. 18 to 20 VCC Positive Power Supply Input. EPAD Exposed Thermal Pad. No internal electrical connection. Connect the exposed pad to a solid external plane with low thermal resistance. Rev. 0 | Page 7 of 24 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications ±20 V Supply ±5 V Supply Absolute Maximum Ratings Maximum Power Dissipation ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Applications Information , Initial Power-Up, and Short-Circuit Thermal Protection Shutdown () Feedback Resistor Selection Capacitive Load Driving Heat and Thermal Management Power Dissipation Safe Operating Area Printed Circuit Board (PCB) Thermal Modeling Heat Sink Selection Power Supplies and Decoupling Composite Amplifier Outline Dimensions Ordering Guide
2
2. CONNECT THE EXPOSED PAD TO A SOLID EXTERNAL
-10
PLANE WITH LOW THERMAL RESISTANCE.
12125 Figure 3. Pin Configuration
Table 5. Pin Function Descriptions Pin No. Mnemonic Description
1 VCC Positive Power Supply Input. 2 TFL Thermal Monitor and Short-Circuit Flag (Referenced to VEE). 3 SD Shutdown (Active Low, Referenced to VEE). 4 ON Turn On/Enable (Active Low, Referenced to VEE). 5 NC No Connect. Do not connect to this pin. 6 INP Noninverting Input. 7 INN Inverting Input. 8 OUT Output Connection for Feedback Resistor. 9 NC No Connect. Do not connect to this pin. 10 to 13 VEE Negative Power Supply Input. 14 to 17 OUT Output. 18 to 20 VCC Positive Power Supply Input. EPAD Exposed Thermal Pad. No internal electrical connection. Connect the exposed pad to a solid external plane with low thermal resistance. Rev. 0 | Page 7 of 24 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications ±20 V Supply ±5 V Supply Absolute Maximum Ratings Maximum Power Dissipation ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Applications Information , Initial Power-Up, and Short-Circuit Thermal Protection Shutdown () Feedback Resistor Selection Capacitive Load Driving Heat and Thermal Management Power Dissipation Safe Operating Area Printed Circuit Board (PCB) Thermal Modeling Heat Sink Selection Power Supplies and Decoupling Composite Amplifier Outline Dimensions Ordering Guide
