Datasheet BAV99 (NXP) - 8
| Manufacturer | NXP |
| Description | High-speed switching diodes |
| Pages / Page | 14 / 8 — NXP Semiconductors. BAV99 series. High-speed switching diodes. 11. … |
| File Format / Size | PDF / 341 Kb |
| Document Language | English |
NXP Semiconductors. BAV99 series. High-speed switching diodes. 11. Soldering
Model Line for this Datasheet
Text Version of Document
NXP Semiconductors BAV99 series High-speed switching diodes 11. Soldering
3.3 2.9 1.9 solder lands solder resist 3 1.7 2 solder paste occupied area 0.7 0.6 (3×) (3×) Dimensions in mm 0.5 (3×) 0.6 (3×) 1 sot023_fr
Fig 10. Reflow soldering footprint BAV99 (SOT23/TO-236AB)
2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 2.6 solder resist occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 sot023_fw
Fig 11. Wave soldering footprint BAV99 (SOT23/TO-236AB)
BAV99_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 8 — 18 November 2010 8 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents
3.3 2.9 1.9 solder lands solder resist 3 1.7 2 solder paste occupied area 0.7 0.6 (3×) (3×) Dimensions in mm 0.5 (3×) 0.6 (3×) 1 sot023_fr
Fig 10. Reflow soldering footprint BAV99 (SOT23/TO-236AB)
2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 2.6 solder resist occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 sot023_fw
Fig 11. Wave soldering footprint BAV99 (SOT23/TO-236AB)
BAV99_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 8 — 18 November 2010 8 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents
