Datasheet BAV99 (NXP) - 9
| Manufacturer | NXP |
| Description | High-speed switching diodes |
| Pages / Page | 14 / 9 — NXP Semiconductors. BAV99 series. High-speed switching diodes. Fig 12. … |
| File Format / Size | PDF / 341 Kb |
| Document Language | English |
NXP Semiconductors. BAV99 series. High-speed switching diodes. Fig 12. Reflow soldering footprint BAV99S (SOT363/SC-88)
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NXP Semiconductors BAV99 series High-speed switching diodes
2.65 solder lands 2.35 1.5 0.6 0.4 (2 0.5 ×) (4×) solder resist (4×) solder paste 0.5 0.6 occupied area (4×) (2×) 0.6 Dimensions in mm (4×) 1.8 sot363_fr
Fig 12. Reflow soldering footprint BAV99S (SOT363/SC-88)
1.5 solder lands 4.5 0.3 2.5 solder resist occupied area 1.5 Dimensions in mm preferred transport direction during soldering 1.3 1.3 2.45 5.3 sot363_fw
Fig 13. Wave soldering footprint BAV99S (SOT363/SC-88)
BAV99_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 8 — 18 November 2010 9 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents
2.65 solder lands 2.35 1.5 0.6 0.4 (2 0.5 ×) (4×) solder resist (4×) solder paste 0.5 0.6 occupied area (4×) (2×) 0.6 Dimensions in mm (4×) 1.8 sot363_fr
Fig 12. Reflow soldering footprint BAV99S (SOT363/SC-88)
1.5 solder lands 4.5 0.3 2.5 solder resist occupied area 1.5 Dimensions in mm preferred transport direction during soldering 1.3 1.3 2.45 5.3 sot363_fw
Fig 13. Wave soldering footprint BAV99S (SOT363/SC-88)
BAV99_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 8 — 18 November 2010 9 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents
