Datasheet AD8601, AD8602, AD8604 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | Precision CMOS, Single-Supply, Rail-to-Rail, Input/Output Wideband Operational Amplifiers |
| Pages / Page | 24 / 5 — AD8601/AD8602/AD8604. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table … |
| Revision | G |
| File Format / Size | PDF / 352 Kb |
| Document Language | English |
AD8601/AD8602/AD8604. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 3. Parameter Rating. Table 4. Thermal Resistance
Model Line for this Datasheet
- AD8601ARTZ-R2 AD8601ARTZ-REEL AD8601ARTZ-REEL7 AD8601WARTZ-R7 AD8601WARTZ-RL AD8601WDRTZ-REEL AD8601WDRTZ-REEL7
Text Version of Document
AD8601/AD8602/AD8604 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3.
θ
Parameter Rating
JA is specified for worst-case conditions, that is, a device soldered onto a circuit board for surface-mount packages using Supply Voltage 6 V a standard 4-layer board. Input Voltage GND to VS Differential Input Voltage ±6 V
Table 4. Thermal Resistance
Storage Temperature Range −65°C to +150°C
Package Type θJA θJC Unit
Operating Temperature Range −40°C to +125°C 5-Lead SOT-23 (RJ) 190 92 °C/W Junction Temperature Range −65°C to +150°C 8-Lead SOIC (R) 120 45 °C/W Lead Temperature Range (Soldering, 60 sec) 300°C 8-Lead MSOP (RM) 142 45 °C/W ESD 2 kV HBM 14-Lead SOIC (R) 115 36 °C/W 14-Lead TSSOP (RU) 112 35 °C/W Stresses above those listed under Absolute Maximum Ratings 16-Lead QSOP (RQ) 115 36 °C/W may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational
ESD CAUTION
section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. G | Page 5 of 24 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION PIN CONFIGURATIONS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION RAIL-TO-RAIL INPUT STAGE INPUT OVERVOLTAGE PROTECTION OVERDRIVE RECOVERY POWER-ON TIME USING THE AD8602 IN HIGH SOURCE IMPEDANCE APPLICATIONS HIGH SIDE AND LOW SIDE, PRECISION CURRENT MONITORING USING THE AD8601 IN SINGLE-SUPPLY, MIXED SIGNAL APPLICATIONS PC100 COMPLIANCE FOR COMPUTER AUDIO APPLICATIONS SPICE MODEL OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS
θ
Parameter Rating
JA is specified for worst-case conditions, that is, a device soldered onto a circuit board for surface-mount packages using Supply Voltage 6 V a standard 4-layer board. Input Voltage GND to VS Differential Input Voltage ±6 V
Table 4. Thermal Resistance
Storage Temperature Range −65°C to +150°C
Package Type θJA θJC Unit
Operating Temperature Range −40°C to +125°C 5-Lead SOT-23 (RJ) 190 92 °C/W Junction Temperature Range −65°C to +150°C 8-Lead SOIC (R) 120 45 °C/W Lead Temperature Range (Soldering, 60 sec) 300°C 8-Lead MSOP (RM) 142 45 °C/W ESD 2 kV HBM 14-Lead SOIC (R) 115 36 °C/W 14-Lead TSSOP (RU) 112 35 °C/W Stresses above those listed under Absolute Maximum Ratings 16-Lead QSOP (RQ) 115 36 °C/W may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational
ESD CAUTION
section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. G | Page 5 of 24 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION PIN CONFIGURATIONS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION RAIL-TO-RAIL INPUT STAGE INPUT OVERVOLTAGE PROTECTION OVERDRIVE RECOVERY POWER-ON TIME USING THE AD8602 IN HIGH SOURCE IMPEDANCE APPLICATIONS HIGH SIDE AND LOW SIDE, PRECISION CURRENT MONITORING USING THE AD8601 IN SINGLE-SUPPLY, MIXED SIGNAL APPLICATIONS PC100 COMPLIANCE FOR COMPUTER AUDIO APPLICATIONS SPICE MODEL OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS
