Offers Wider Creepage Distance; Suited to Applications with Strict Height Requirements
Toshiba America Electronic Components, Inc. (TAEC) announced the launch of a new transistor output photocoupler in a low-height SO6L 4 pin package – the TLP385. With its low-height of 2.3 mm (max), 45 percent lower than DIP4 packages, the TLP385 can be used in situations with strict height requirements. Applications including motherboards, programmable logic controllers, AC adapters, I/O interface boards, inverter interfaces and general purpose power supplies are suited to the new photocouplers.
Toshiba's new photocoupler has an isolation specification equivalent to DIP4 F (wide lead) type package products, and provides a creepage and clearance distance of 8 mm (min) and isolation voltage of 5 kVrms (min).
The new transistor output photocouplers are available now. For more details, samples and pricing information, please contact your local Toshiba Sales Office.
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